The Firefly G3 system provides an automated inspection solution for advanced IC substrates and panel level packaging by delivering high resolution and productivity to meet the needs of demanding end applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
The Firefly G3 platform offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique to detect residue defects on metal and metal defects on organic layers. The combination of high sensitivity inspection, 2D/3D metrology and on tool color image capture capability in a single platform reduces capital investment requirements and provides a reliable pathway for panel-based process applications that require high I/O counts and multiple-chip integration.
Integration with Onto Innovation’s Discover® Defect and TrueADC® software quickly turns defect data into actionable process control, improves defect classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.