Dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages.
The Packaging Applications Center of Excellence (PACE) is our newest collaborative space located at Onto Innovation Headquarters in Wilmington, Massachusetts.
The PACE advanced manufacturing space combines the power of Onto Innovation technologies with our network of collaboration partners, aiming to accelerate advanced packaging R&D. This space is equipped with Onto's next generation panel level photolithography, inspection, and metrology tools, including our latest software capabilities.
Coater/Laminator | Dedicated Stepper | Automated Developer | SEM Cross Section | Overlay & CD Metrology | Film Thickness Measurement | Curing Ovens | Integrated Solutions | Advanced Process Development | Improved Products & Support | Dedicated Apps Lab Staff
Reach out to Onto Innovation today to discuss collaboration opportunities, lab visits and more. Join our growing list of industry partners!