Enhance Your Tool Results with Onto Software
- Data Management: Comprehensive perspective of results over time for inline monitoring, alarming, and reporting of inspection and metrology results (Discover Defect)
- Review: Manually view and classify defects to update inspection, ADC, and SPR codes on inspected materials without impacting tool capacity. (Discover Review)
- Reporting: Communicate the results that drive action into factory systems and information for end-user graphics. (Discover Report)
- Automated Defect Classification: The automation necessary to classify anomalies prior to wafers exiting the AOI tool (TrueADC Front, Edge, and Backside, TrueADC+, TrueADC Edge)
- Spatial Pattern Recognition: Pattern recognition to control tool binning, tool image capture, and post-process analysis (Discover Pattern) High-volume metrology: Effective solution to handle and store 2GB+, 100M+ bumps result files produced when high bump count wafers are evaluated for all requisite metrology (Discover HVM Bump Server)
