With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
Advanced packaging lithography system for round substrates up to 330mm
Advanced packaging lithography system for rectangular or square panel substrates up to Gen 3.5 size (720mm x 600mm)
High-resolution imaging for flat panel display applications up to Gen 3.5 size
High-resolution imaging for flat panel display applications up to Gen 4.5 size
Designed for advanced integrated circuit substrates (AICS) or advanced packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm L/S resolution over a large DOF and with a throughput of >110pph