Lithography

Onto Innovation's latest fleet of steppers for advanced packaging will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.

Onto Innovation Lithography Products

JetStep S3500 System

Advanced packaging lithography system for rectangular or square panel substrates up to Gen 3.5 size (720mm x 600mm)

JetStep S3500 System

JetStep X500 System

Designed for advanced integrated circuit substrates (AICS) or advanced packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm L/S resolution over a large DOF and with a throughput of >110pph

JetStep X500 System

Selected Papers and Articles

StepFAST Solution: Optimized Lithography for Fan-out Packaging

Blog Post

Optimized Stepping for Fan-out Wafer and Panel Packaging

Article for Solid State Technology

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