With steppers for advanced packaging and flat panel display technology, Rudolph's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
High-resolution imaging for flat panel display applications up to Gen 3.5 size
High-resolution imaging for flat panel display applications up to Gen 4.5 size
Advanced packaging lithography system for rectangular or square panel substrates up to 720mm x 600mm substrate size
Designed for PCB or Advanced Packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm resolution over a broad DOF with throughput of >110pph
Advanced packaging lithography system for 200mm, 300mm and 330mm wafer sizes