Product Overview
The IVS 220 system has been designed for ultimate precision, TIS (tool induced shift) and throughput on 100mm to 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 system provides the same capability in a system designed for overhead track handling with full E84 GEM300 capability.
Flexibility is key in compound semiconductor processes where many different wafer sizes, thicknesses and processes may run on the same line. The IVS system is ideal for these conditions. Versatile wafer handling accommodates many variations in wafer composition including Si, SiC, quartz, glass, GaAs, GaN, and LiNO3 wafers.
The IVS series helps ensure optimal system availability and years of problem-free operation. The robust design of the wafer handling and navigation system requires no operator assistance during recipe execution. The IVS 220 system enables wafer sizes to be changed with no alterations to the hardware. Recipes and data remain stable over time. The IVS series also provides the ability to transfer recipes from older versions of the IVS platform such as the IVS 185 and IVS 200.
Specific algorithms for MEMS applications allow for measurement of a wide array of MEMS structures. The demonstrated capabilities of the IVS series to perform with high precision and solid reliability set this system apart.
Applications
- Silicon and germanium
- Compound semiconductor (GaAs, GaN, InP)
- Power devices (Si, SiC, GaN-on-Si)
- RF (GaAs, InP, GaN-on-SiC)
- MEMS (Si, LiNO3, glass, sapphire)
- LED (GaAs, GaN-on-sapphire)
- Advanced Packaging (Si, bonded wafers, glass, CCL)
3D Demo
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