Series Overview
IVS 380 System
The IVS 380 system is designed for high volume manufacturing, with SMIF (200mm substrate) or FOUP (300mm substrate) load ports compatible with AGV or OHT pod robots. The IVS 380 system has been adopted for a variety of substrates used for advanced packaging.
The IVS 380 optical overlay and CD metrology system is highly flexible, handling a wide variety of substrate sizes, from 150mm to 300mm, and substrate materials including Si, glass and CCL. The IVS 380 system can measure the dimensions of 3D structures that are making advanced packaging a promising tool in the More than Moore era and a premier tool for power devices.
Building upon the IVS family’s 40 years of experience in CMOS, MEMS and compound semiconductor applications, the IVS 380 system possesses the versatility to tackle overlay, CD and height measurements for a variety of difficult substrates and layers.
IVS systems can measure critical dimensions in the xy plane, plus measure the vertical z-heights of features such as RDL metal lines, posts and bumps. The superior optics of IVS enable focus on mostly transparent materials such as photoresists, as well as rough surfaces such as electroplated copper.
IVS 220 & 280 Systems
The IVS 220 system has been designed for ultimate precision, TIS (tool induced shift) and throughput on 100mm to 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) > 2,000 hours. The IVS 280 system provides the same capability in a system designed for overhead track handling with full E84 GEM300 capability.
Flexibility is key in compound semiconductor processes where many different wafer sizes, thicknesses and processes may run on the same line. The IVS system is ideal for these conditions. Versatile wafer handling accommodates many variations in wafer composition including Si, SiC, quartz, glass, GaAs, GaN, and LiNO3 wafers.
The IVS series helps ensure optimal system availability and years of problem-free operation. The robust design of the wafer handling and navigation system requires no operator assistance during recipe execution. The IVS 220 system enables wafer sizes to be changed with no alterations to the hardware. Recipes and data remain stable over time. The IVS series also provides the ability to transfer recipes from older versions of the IVS platform such as the IVS 185 and IVS 200.
Specific algorithms for MEMS applications allow for measurement of a wide array of MEMS structures. The demonstrated capabilities of the IVS series to perform with high precision and solid reliability set this system apart.
Applications
- Silicon and germanium
- Compound semiconductor (GaAs, GaN, InP)
- Power devices (Si, SiC, GaN-on-Si)
- RF (GaAs, InP, GaN-on-SiC)
- MEMS (Si, LiNO3, glass, sapphire)
- LED (GaAs, GaN-on-sapphire)
- Advanced Packaging (Si, bonded wafers, glass, CCL)
3D Demo
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