The IVS series provides optical overlay and CD metrology for the semiconductor, compound semi, power devices, RF, MEMS, and LED markets. The systems deliver superior measurement performance with overlay and CD measurements in the same recipe.
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
Flexibility is key in compound semiconductor processes where many different wafer sizes, thicknesses and processes may run on the same line. The IVS system is ideal for these conditions. Versatile wafer handling accommodates many variations in wafer composition including silicon, silicon carbide, quartz, glass, GaAs, GaN, LiNO3, InP.
The IVS series also provides the ability to upgrade recipes from older versions of the IVS platform such as the IVS 120, IVS 130, IVS 135, IVS 165 and IVS 185.
The IVS series helps ensure optimal system availability and years of problem-free operation. The robust design of the wafer handling and navigation system requires no operator assistance during recipe execution. Recipes and data remain stable over time.
Specific algorithms for MEMS applications allow for measurement of a wide array of MEMS structures. The demonstrated capabilities of the IVS series to perform with high precision and solid reliability set this system apart.
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