With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
Sub-micron automatic defect inspection for for advanced IC substrates and panel level packaging
Automated high speed sub-micron 2D inspection and combo 3D inspection/metrology for inline process control of pattern defects and next generation technologies for advanced packaging, specialty and OQA
Unpatterned edge, notch and backside inspection
Advanced macro inspection for front-end manufacturers
Edge and backside inspection
2D automated defect inspection and sample 3D inspection for advanced packaging
Software solutions to increase the value of data available from your inspection tool