With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
Sub-micron automatic defect inspection for wafers and panels
Automated high speed sub-micron 2D inspection and combo 3D inspection/metrology for inline process control of pattern defects and next generation technologies for advanced packaging, specialty and OQA
Unpatterned edge, notch and backside inspection
Advanced macro inspection for front-end manufacturers
Edge and backside inspection
2D automated defect inspection and sample 3D inspection for advanced packaging
Automated frontside inspection of unpatterned wafers
Software solutions to increase the value of data available from your inspection tool