With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
Sub-micron automatic defect inspection for wafers and panels
High speed 2D/3D automated inspection and metrology for defects and bumps
Unpatterned edge, notch and backside inspection
Advanced macro inspection for front-end manufacturers
Edge and backside inspection
2D automated defect inspection and sample 3D inspection for advanced packaging
Automated frontside inspection of unpatterned wafers