EchoScan™ System

Wafer bonding is a key process in various 3D integration schemes like die-to-wafer (D2W) and wafer-to-wafer (W2W) stacking. Bonding quality is important and voids, especially micro voids down to 1μm between Cu pads, can cause failures. Detecting these voids early with inline, non-contact, non-destructive techniques is essential. Traditional methods like scanning acoustic microscopy (C-SAM) lack the needed resolution and may have issues with water couplants, prompting the need for alternative high-volume manufacturing techniques.

Product Overview

The EchoScan system is a die and wafer-level immersion-free non-contact technology to detect voids down to 1µm sensitivity in high volume manufacturing. Based on proprietary PULSE technology, Onto's solution uses properties of laser/matter interaction to detect voids whether they are located in dielectric or metal layers. This unique IR wavelength laser-based system enables detection through full Si thickness and can image voids in buried structures and/or bonded interfaces. 

When paired with Discover analytical software, the EchoScan system enables real-time defect analysis and feedback to process tools for statistical process control, reducing the cycle time of yield loss assessment and helping customers achieve high volume manufacturing goals.

EchoScan System
EchoScan System

Applications

  • Void detection in direct bonded and hybrid bonded wafers

Downloads & Links

Onto Innovation Advances Process Control Suite for 3D Interconnect Yields

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