Metrology, defect inspection, lithography, and smart manufacturing software solutions for semiconductor manufacturers to accelerate product and process development, increase yields and reduce costs to enable customers to be first-to-market with premium products at premium prices.
Technology and solutions spanning incoming bare wafer inspection to final package. Focused on the most complex process challenges.
Explore how your process could improve:
Bare Wafer/Panel
Bare wafer manufacturers provide the quality silicon wafers needed for today's semiconductor manufacturing.
Logic/Foundry
Moore's Law continues to drive the scaling of logic devices and, likewise, the challenges to process and process control.
Memory
Memory has become the cornerstone of the mobile world and one of the most critical semiconductor devices manufactured today.
RF/MEMS
Mobile communications and miniaturization has led to an explosion in the quantity and complexity of the RF devices needed in this connected world.
Image Sensors
Cameras have revolutionized the way we see the world through our mobile devices. Pixel size has decreased and the array density increased to improve camera resolution.
Advanced Packaging
Whether on wafer or panel, advanced packaging offers reduced package cost and/or form factor. See how Onto Innovation can solve the most pressing challenges.
LED/Power
With a growing number of applications for High Brightness LEDs, manufacturers are looking for better strategies to increase yield and improve performance.
Probe Test
Probe (or "wafer" or "sort") test is increasingly more important as hybrid and 2.5/3D devices become prevalent.
Today’s mobile displays are becoming more sophisticated and new technologies are needed to advance the industry to next-generation technologies such as foldable and rollable displays.
Industrial/Scientific
Across many industries, 4D Technology’s measurement products are enabling new engineering and manufacturing advances.
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Featured Technology
All-surface inspection is critical for quality assurance at foundries and IDMs producing advanced packages. The prevalence of edge-handling equipment needed to accommodate thinner wafers can produce chips and cracks that potentially propagate into the die near the wafer’s edge, which becomes a costly loss on a finished wafer.
Onto Innovation’s EB40 edge and backside inspection module not only introduces backside edge bead-removal metrology, but also offers a significant shift in sensitivity enabled by a new algorithm for defect detection, allowing this powerful tool to find edge cracks, backside scratches, residue, wafer level defect signatures, delamination defects, blister defects and more.
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Jun 19, 2025
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Jun 10, 2025
Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
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Advancing manufacturing innovation. Faster. Smarter. Together.
Do you have passion for solving challenges? Do you have a desire to use innovation and collaboration to drive results? Do you believe in putting customers first to become successful? If so, we want to talk with you.