Metrology, defect inspection, lithography, and smart manufacturing software solutions for semiconductor manufacturers to accelerate product and process development, increase yields and reduce costs to enable customers to be first-to-market with premium products at premium prices.
Technology and solutions spanning incoming bare wafer inspection to final package. Focused on the most complex process challenges.
Explore how your process could improve:
Bare Wafer
Bare wafer manufacturers provide the quality silicon wafers needed for today's semiconductor manufacturing.
Logic/Foundry
Moore's Law continues to drive the scaling of logic devices and, likewise, the challenges to process and process control.
Memory
Memory has become the cornerstone of the mobile world and one of the most critical semiconductor devices manufactured today.
RF/MEMS
Mobile communications and miniaturization has led to an explosion in the quantity and complexity of the RF devices needed in this connected world.
Image Sensors
Cameras have revolutionized the way we see the world through our mobile devices. Pixel size has decreased and the array density increased to improve camera resolution.
Advanced Packaging
Whether on wafer or panel, advanced packaging offers reduced package cost and/or form factor. See how Onto Innovation can solve the most pressing challenges.
LED/Power
With a growing number of applications for High Brightness LEDs, manufacturers are looking for better strategies to increase yield and improve performance.
Probe Test
Probe (or "wafer" or "sort") test is increasingly more important as hybrid and 2.5/3D devices become prevalent.
Flat Panel Display
Today’s mobile displays are becoming more sophisticated and new technologies are needed to advance the industry to next-generation technologies such as foldable and rollable displays.
Industrial/Scientific
Across many industries, 4D Technology’s measurement products are enabling new engineering and manufacturing advances.
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Featured Technology
While fan-out packaging has many advantages, it also faces significant challenges. Our optimized lithography solution for fan-out packaging can increase productivity.
The Onto Innovation StepFAST™ Solution is a feed-forward adaptive shot technology that addresses process variations, die placement errors and dimensionally unstable materials. Using a parallel die placement measurement process and advanced analytics, Onto Innovation’s StepFAST Solution provides a means to balance productivity (throughput) against yield, adding an extra dimension of flexibility for optimized profitability.
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What's New
Jan 14, 2020
Onto Innovation Announces Multiple Orders for 2D Inspection Systems to Support 5G Ramp
Company News
Jan 3, 2020
Onto Innovation to Present at the 22nd Annual Needham Growth Conference
Company News
Nov 7, 2019
Onto Innovation Reports Third Quarter 2019 Results, Combined Company Guidance and Additional Merger Details
Company News
Nov 1, 2019
End-to-End Data Management Essential to Meet Reliability Requirements of Automotive Electronics
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