Metrology, defect inspection, lithography, and smart manufacturing software solutions for semiconductor manufacturers to accelerate product and process development, increase yields and reduce costs to enable customers to be first-to-market with premium products at premium prices.
Technology and solutions spanning incoming bare wafer inspection to final package. Focused on the most complex process challenges.
Explore how your process could improve:
Bare Wafer
Bare wafer manufacturers provide the quality silicon wafers needed for today's semiconductor manufacturing.
Logic/Foundry
Moore's Law continues to drive the scaling of logic devices and, likewise, the challenges to process and process control.
Memory
Memory has become the cornerstone of the mobile world and one of the most critical semiconductor devices manufactured today.
RF/MEMS
Mobile communications and miniaturization has led to an explosion in the quantity and complexity of the RF devices needed in this connected world.
Image Sensors
Cameras have revolutionized the way we see the world through our mobile devices. Pixel size has decreased and the array density increased to improve camera resolution.
Advanced Packaging
Whether on wafer or panel, advanced packaging offers reduced package cost and/or form factor. See how Onto Innovation can solve the most pressing challenges.
LED/Power
With a growing number of applications for High Brightness LEDs, manufacturers are looking for better strategies to increase yield and improve performance.
Probe Test
Probe (or "wafer" or "sort") test is increasingly more important as hybrid and 2.5/3D devices become prevalent.
Flat Panel Display
Today’s mobile displays are becoming more sophisticated and new technologies are needed to advance the industry to next-generation technologies such as foldable and rollable displays.
Industrial/Scientific
Across many industries, 4D Technology’s measurement products are enabling new engineering and manufacturing advances.
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Featured Technology
Use artificial intelligence enabled automatic defect classification (ADC) to ensure product quality as you go down the road to digital transformation and achieve results through Industry 4.0 best practices.
The Onto Innovation TrueADC® software solution is strongly coupled to the artificial intelligence capabilities of TensorFlow. Supporting 21 versions of transfer learning models, including Xception and ResNet, our ADC solution is capable of classifying any anomaly. The inherent flexibility of TrueADC software allows for third party (customer model) plugins, with or without using Onto Innovation supported models. With an interface simple enough to be 100% supported by a fab engineer or technician, TrueADC software is differentiated by its ability to execute in a multi-engine classification mode. This gives our customers an added perspective for optimum classification performance superior to any single classifier approach.
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May 18, 2022
Onto Innovation to Participate in Three Upcoming Investor Conferences
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May 3, 2022
Onto Innovation Reports 2022 First Quarter Results
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Apr 12, 2022
Nip the Defect in the Bud: Using an external inspection system and FDC software increases ABF substrate yield
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Do you have passion for solving challenges? Do you have a desire to use innovation and collaboration to drive results? Do you believe in putting customers first to become successful? If so, we want to talk with you.