Metrology, defect inspection, lithography, and smart manufacturing software solutions for semiconductor manufacturers to accelerate product and process development, increase yields and reduce costs to enable customers to be first-to-market with premium products at premium prices.
Technology and solutions spanning incoming bare wafer inspection to final package. Focused on the most complex process challenges.
Explore how your process could improve:
Bare Wafer
Bare wafer manufacturers provide the quality silicon wafers needed for today's semiconductor manufacturing.
Logic/Foundry
Moore's Law continues to drive the scaling of logic devices and, likewise, the challenges to process and process control.
Memory
Memory has become the cornerstone of the mobile world and one of the most critical semiconductor devices manufactured today.
RF/MEMS
Mobile communications and miniaturization has led to an explosion in the quantity and complexity of the RF devices needed in this connected world.
Image Sensors
Cameras have revolutionized the way we see the world through our mobile devices. Pixel size has decreased and the array density increased to improve camera resolution.
Advanced Packaging
Whether on wafer or panel, advanced packaging offers reduced package cost and/or form factor. See how Onto Innovation can solve the most pressing challenges.
LED/Power
With a growing number of applications for High Brightness LEDs, manufacturers are looking for better strategies to increase yield and improve performance.
Probe Test
Probe (or "wafer" or "sort") test is increasingly more important as hybrid and 2.5/3D devices become prevalent.
Flat Panel Display
Today’s mobile displays are becoming more sophisticated and new technologies are needed to advance the industry to next-generation technologies such as foldable and rollable displays.
Industrial/Scientific
Across many industries, 4D Technology’s measurement products are enabling new engineering and manufacturing advances.
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Featured Technology
With the continuous scaling of semiconductor devices, fab manufacturers are demanding to measure new, more complex 3D structures with a smaller error budget.
Onto Innovation’s AI-Diffract™ Technology is the first in market AI-guided OCD engine that synergizes physics-based modeling and machine learning to deliver the most robust solution in a timely manner. It powers the most comprehensive and cutting-edge OCD metrology solutions with best-in-class metrology performance and increased productivity to enable continuous scaling of semiconductor devices
Upcoming Events
What's New
Apr 6, 2021
How Do Machines Learn?
Blog Post
Apr 5, 2021
Onto Innovation Schedules 2021 First Quarter Financial Results Conference Call for April 29, 2021
Company News
Mar 25, 2021
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Memory Manufacturing
Article
Mar 16, 2021
New Advances in Mid-Infrared Critical Dimension Ellipsometry and Machine Learning
Presentation
Advancing manufacturing innovation. Faster. Smarter. Together.
Do you have passion for solving challenges? Do you have a desire to use innovation and collaboration to drive results? Do you believe in putting customers first to become successful? If so, we want to talk with you.