JetStep® X500 System

The Onto Innovation JetStep X500 system is designed to provide AICS and OSAT manufacturers with a lithography solution capable of high volume manufacturing, with applications spanning heterogeneous integration and serving high-performance computing, mobile device, automotive, advanced packaging, medical and other industrial areas. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.

Product Overview

The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp. The JetStep X500 system incorporates the largest available exposure field with resolution capability to 3µm L/S and options for increased resolution to 1µm L/S at smaller field sizes.



Applications

Specifications

  • 3µm L/S resolution with a high-fidelity projection lens and illumination system that delivers a large process window
  • 250mm x 250mm square exposure field 
  • ±1µm overlay capability
  • ±100 ppm magnification compensation (automatic) with independent x, y magnification adjustment (Anamorphic Magnification Adjustment)
  • ±400 ppm radial magnification compensation (automatic)
  • Automatic compensation of die shift for superior registration to zero layer
  • 6 inch square reticle format enables cost efficient reticle and lower COO

  • 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
  • Automated reticle handling and storage system with fast reticle exchange to maximize throughput
  • Fully programmable and flexible pattern recognition alignment system
  • Real time “on the fly” autofocus at every exposure site to automatically adjust focus over panel topology
  • Environmental management system to mitigate fab contamination
  • Handling: laminated substrates (typically 500(510) x 500(515) mm2) square and rectangle, silicon, glass, other composite materials

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