The Rudolph JetStep X500 system is designed to provide PCB and OSAT manufacturers with a lithography solution capable of high volume manufacturing for applications in the mobile devices, automotive, advanced packaging, medical or other industrial areas. The Rudolph Jetstep X500 exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
The Rudolph JetStep X500 panel lithography system is optimized for volume manufacturing of high-end PCB and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of PCB or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp. The JetStep X500 system incorporates the largest available exposure field with resolution capability to 3/3 and options for increased resolution to 1/1 at smaller field sizes.