The Onto Innovation JetStep X500 system is designed to provide AICS and OSAT manufacturers with a lithography solution capable of high volume manufacturing, with applications spanning heterogeneous integration and serving high-performance computing, mobile device, automotive, advanced packaging, medical and other industrial areas. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates the industry's largest field exposure system, with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine line RDL resolution with large depth of focus (DOF), high overlay accuracy, automatic magnification compensation with independent x and y magnification adjustment, handling a large range of substrate thicknesses with high levels of warp.