The Iris series of tools enable process control across a broad range of applications in high volume manufacturing with excellent performance as well as cost-of-ownership.
For 300mm silicon manufacturing
The Iris system is targeted to provide our customer the best cost-of-ownership with a dedicated application-specific optical configuration for HVM applications in semiconductor manufacturing.
The Iris C1 system combines a proprietary spectroscopic ellipsometry solution from the Atlas® family with Onto Innovation’s industry leading Ai Diffract™ OCD analysis software, enabling high precision control of every critical semiconductor process step. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The system also features advanced pattern recognition, improved thickness reproducibility and throughput. The software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The Iris system and Ai Diffract solution provides insight of complex structure profiles across etch, clean, deposition, CMP and thin films.
The Iris T1 is a spectroscopic ellipsometer system that provides accurate, repeatable in-line thickness and optical constant measurements of single and multi-layer dielectric films for fab-wide applications. Built on the same field-proven Atlas platform, the Iris T1 system leverages the most recent advances in optics and algorithms, making it best-in-class for performance and cost-of-ownership. The SEMI/CE compliant software interface enables recipe sharing between the Iris series.
Based on a common HBLS optical design derived from our seventh generation Atlas platform and best-in-class deep ultraviolet (DUV) optics, the Iris R1 system offers maximum sensitivity and accuracy to CMP process excursions and enables device makers to establish APC control solutions with high-accuracy feedback. With SpectraProbe™ and NanoDiffract® analysis solutions enabling direct measurements within device and active areas, users are now able to monitor minor process excursions and optimize their processes for higher yields.
For SiC, GaN, glass and silicon manufacturing
The Iris S system offers a single platform solution for thin film, OCD, and wafer bow and film stress measurements on 150, 200 & 300mm wafers. It can handle a broad variety of substrates, including but not limited to SiC, GaN, glass and silicon. The system incorporates a dual-arm robot, high-precision stage, advanced pattern recognition, and a high-speed focus system for high positioning accuracy at high throughput. A state-of-the-art dual channel optical architecture offers oblique incidence Mueller Matrix spectroscopic ellipsometry (MMSE) and normal incidence spectroscopic reflectometry (SR) in a broad wavelength range from UV to IR wavelengths.
Based on the latest Windows 10 OS and a 64-bit architecture, the Ai Diffract™ software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. Ai Diffract software also includes Onto’s unique model guided machine learning that enables fast, flexible and robust film and OCD recipe setup on the Iris S system.