The Atlas thin film and OCD series is the metrology tool for leading-edge FinFET, gate-all-around (GAA) FET, 3D NAND, and advanced DRAM device manufacturing.
The Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab. The sensitivity of Atlas V metrology enables these critical dimensions to be measured with high accuracy and sensitivity, extending the capability of optical solutions for generations of devices and eliminating the need for other slower process control techniques.
The Atlas V technology enables the performance needed for customers’ development of GAA/3D NAND/DRAM and is over 100 times faster than X-ray solutions for these structures. Select Onto Innovation customers have validated this new OCD technology and have seen the speed and resolution that was once thought to be beyond the limits of optical technology.
By extending metrology performance to sub-angstrom precision and accuracy levels, the Atlas III+ system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas family of products incorporate a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s industry leading Ai Diffract™ OCD analysis software, enable process control of every critical manufacturing unit operation. The Atlas III+ system and Ai Diffract solution provides insight of complex structure profiles across etch, clean, deposition and CMP steps.
The Atlas S system offers a single platform for thin film, OCD and wafer bow, film stress measurements for both 200mm and 300mm wafer metrology. The Atlas S system can handle a broad variety of substrates, including but not limited to SiC, GaN, glass and silicon. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. It also features advanced pattern recognition, improved thickness reproducibility with superior throughput compared to the previous generation Atlas XP+ system. A state-of-the-art optical engine enables oblique incidence spectroscopic ellipsometry (SE) and normal incidence spectroscopic reflectometry (SR) in a broad wavelength range from UV to IR wavelengths. Based on the latest Windows 10 OS and a 64-bit architecture, the Ai Diffract™ software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. Ai Diffract software also includes Onto’s unique model guided machine learning which enables a fast, flexible and robust OCD recipe suite on the Atlas S system.
Integrated thin film and OCD metrology solution with high resolution and repeatability for very thin films
Comprehensive OCD solutions for inline metrology, offline computing and fleet management
OCD and film metrology for memory manufacturers
OCD and film metrology for logic/foundry manufacturers