S3000/S2000™ Series

High throughput focused beam laser ellipsometry and reflectometer system that provides accurate thickness and refractive index measurements for a wide range of materials for semiconductor process control.

Product Overview

Faced with the increasing complexity of semiconductor manufacturing processes, IDMs and foundries rely on high performance production-worthy transparent film metrology for fabwide process control.

Onto Innovation’s S3000 Series of metrology systems deliver superior measurement accuracy, repeatability and tool-to-tool matching on a highly reliable and flexible platform. Utilizing Onto Innovation’s patented focused beam laser ellipsometry (FBE) system with optional deep ultraviolet reflectometry, visible reflectometry, the S3000 System has been qualified to provide on-product process control for logic and memory processes down to the 1x node.

The S2000 Series of metrology systems delivers the same superior measurement accuracy, repeatability and tool-to-tool matching as the S3000 systems. Utilizing Onto Innovation’s patented focused beam laser ellipsometry (FBE) system with optional deep ultraviolet reflectometry, visible reflectometry, the S2000 System has found widespread adoption in the specialty foundry, RF, MEMS market.


S3000 Series
S3000 Series

Applications

Specifications

  • Multi-wavelength, multi-angle FBE offers excellent repeatability and intrinsic tool matching
  • Discrete laser wavelengths 633, 784 and 923nm.
  • Blue wavelength to enhance sensitivity for SiGe and SOI applications
  • Thickness capability from 10Å to 90µm
  • Single and Multi-layer T,n,k for true fabwide metrology
  • Laser ellipsometry offers excellent repeatability due to a very stable light source
  • 190nm small site deep ultraviolet reflectometry (DUVR)

  • Visible reflectometer capable of measurements in 10µm site size
  • Temperature control enables tight gate oxide process monitoring
  • Flexible modular platform combines maximum capability with low CoO
  • Integrated stress bow capability to monitor film stress and wafer bow
  • SmartSearch Modeling algorithm for advanced applications
  • Central Recipe Manager for maintaining fleet security and control
  • Excursion detection

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