Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

This paper presents the first demonstration of fine pitch embedded trench RDL on glass substrates using a new family of ultra-high resolution dry film photo-sensitive polymer dielectrics and a new large area panel scale lithography tool. The specific research targets are to demonstrate multilayer RDL scaling to 1um lines and vias at >200 I/Os per mm of die edge for 2.5D interposers and high density fan-out packages.