Series Overview
Atlas G6 System
Leading edge OCD and thin film metrology for next-generation AI applications and beyond
As semiconductor manufacturers push into next-generation GAA nodes and next-gen HBM and vertical DRAM architectures, process control requirements are tightening. Smaller nanosheet structures and denser DRAM cells demand higher measurement precision, faster recipe development, and tighter tool-to-tool matching.
The Atlas® G6 system is engineered to meet these challenges with a new optics design that improves signal-to-noise ratio, spectral stability, and measurement precision. Enhanced software algorithms and data management tools deliver better fleet-wide spectra matching, while a new data channel and next-generation model-guided machine learning in Ai Diffract™ software enable faster, more robust recipe development. A smaller optical spot size ensures accurate measurements on today’s most compact DRAM structures.
Fully integrated with Onto Innovation’s Discover® ecosystem, the Atlas G6 system empowers fabs with predictive process control and smart manufacturing capabilities—accelerating yield and time to market for the industry’s most advanced devices.
Atlas V System
High performance OCD and thin film metrology for advanced GAA and memory devices
The Atlas V system combines state of the art optical design with an innovative Ai Diffract™ modeling engine, providing OCD and thin film metrology solutions for measuring complex 3D device structures. The dual channel optical architecture consists of a DUV 4x4 Mueller Matrix (MM) SE and a DUV polarized normal incident reflectometer (NIOCD). Together, they provide rich information for OCD analysis at high precision and high throughput. The Atlas V system is designed to measure the most critical and challenging process steps that include buried features, not visible by CD-SEM and other techniques.
With unique capabilities, such as measuring individual nanowire dimension in a GAA logic device, the Atlas V system is the an enabling technology for leading edge device process control.
Awards
- 2022 Best of West Award for Atlas V optical critical dimension metrology tool presented by SEMI and Semiconductor Digest
Atlas III+ System
Versatile OCD and thin film metrology for mature and mainstream nodes
The Atlas III+ system is a widely adopted inline OCD metrology system, known for its robust and reliable solutions across all OCD and film layers from FEOL to BEOL. With its information-rich optical architecture, powerful OCD and machine learning analysis engine, the Atlas III+ system excels in advanced logic, 3D NAND and DRAM device processes. Extending metrology performance to sub-angstrom precision and accuracy levels, this system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas III+ system incorporates a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s Ai Diffract™ OCD analysis software, it enables process control of every critical manufacturing unit operation. Users can gain insights into complex structure profiles across etch, clean, deposition and CMP steps.
Applications
- OCD for litho, etch, CVD & CMP process in all device segments
- Memory: DRAM/HBM, 3D NAND, 3D DRAM
- Logic and Foundry: 1X nm and below
- SiC and GaN based power devices
- RF devices
- MEMS devices
Downloads & Links
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