Rudolph receives multi-fab order for Discover Enterprise Yield Management System software, which will provide advanced analytics of bump metrology
Flanders, New Jersey (November 2, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a multi-fab order for its Discover® Enterprise Yield Management System (YMS) software from one of the world’s top three-dimensional (3D) memory device makers. Discover YMS software is a leading yield management solution, traditionally used in front-end semiconductor manufacturing, which has been continually adopted for advanced packaging applications in the back-end. The software was delivered in the third quarter of 2015.
“This multi-fab order is a result of our long-term investment in adding advanced packaging analytic capabilities to Discover YMS software,” stated Thomas Sonderman, vice president and general manager of Rudolph’s Software Business Unit. “Discover YMS software allows our customers to improve the precision and yield of stacked die. Its ability to analyze the big data sets generated from wafers that may each have millions of bumps was a key factor in winning this significant order.”
In the advanced packaging space, bumps are used for both functional electrical interconnect and structural connections to interposers, devices or packaging components. Ever smaller packages, used by the mobility and Internet of Things markets, drive the need for smaller bumps with higher densities. These shrinking geometries and the added complexity of 3D stacking require the ability to perform advanced analytics on bump metrology. Discover YMS software permits customers to take advantage of complex binning strategies to improve device performance and end-of-line yields. It helps control the advanced packaging process by rapidly analyzing the bumps to identify defective die with out-of-specification bump metrology values. The huge data volumes consist of over 20 million bumps, each with 10 or more attributes. This translates to over 200 million data values or attributes per wafer. Discover YMS software was specifically designed to handle these massive data sets, quickly and efficiently.
Mike Plisinski, Rudolph’s executive vice president and chief operating officer, added, “As manufacturers have increased the amount of data they collect both within a factory and across multiple factories, we have focused on leveraging our software solutions to transform that data into actions that reduce cost and improve yields. Specific to packaging, these software solutions, especially when partnered with Rudolph inspection and metrology equipment, allow customers to intelligently collect and analyze data to drive die disposition.”
For more information about Discover YMS software, please visit www.Onto Innovationtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and data analysis systems and software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. The Company’s expanding portfolio of equipment and software provides comprehensive solutions for front-end wafer processing, final manufacturing and advanced packaging of ICs. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.Onto Innovationtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefits to customers of Rudolph’s products, Rudolph’s business momentum and future growth, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s ability to meet the expectations and needs of our customers as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2014 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
Steven R. Roth