Challenges and Solutions for Advanced Packaging Lithography as Interconnect Shrinks Below 2µm Line/Space

As the Advanced Packaging (AP) substrate interconnect density continues to increase rapidly, driven by next generation HPC, AI and VR/AR applications, there has been a paradigm shift in the package architecture to replace organic substrates with glass core substrates. Typically, organic substrates support HVM RDL structures of 9/12 µm line/space and, in R&D, down to 5/5 µm line/space. Beyond this, the substrate’s dimensional stability and flatness will limit the resolution and overlay performance, impacting customer product roadmaps. Glass core substrates are expected to provide the solution. However, glass core has its own challenges. Onto Innovation understands these challenges, and provides solutions through its lithography, inspection, metrology and SW products. Onto Innovation is working with adjacent OEMs and the material supply chain to provide customers with early access to next generation products through its Packaging Applications Center of Excellence (PACE). This talk will discuss the benefits and challenges of both architectures and explores how Lithography steppers can provide a technology roadmap, and pathway, to < 1.5 µm L/S, whilst transitioning from organic to glass substrates.