Motivation
As there are increasing needs for advanced process control (APC) from chemical mechanical polishing (CMP) process in semiconductor high volume manufacturing, a more precise and higher throughput solution is needed.
Description
In this paper as we demonstrate with Onto Innovation’s integrated metrology hardware technology empowered by the machine learning based hybrid metrology engine, we can measure and differentiate sub 10Å top oxide from the rest of the film deck. This enables the inline CMP process control to achieve faster throughput, higher productivity, and improve the CMP process to reduce rework rate.