Advanced Packaging Forum for High Performance Applications

Advanced Packaging and heterogeneous integration technologies have seen increased adoption, driven by the rapidly growing demand for advanced applications like artificial intelligence (AI) and high-performance computing (HPC). Integration at both wafer level and panel level have been adopted to achieve optimal power, performance, area and cost for these applications. This Advanced Packaging Forum will highlight a few of the challenges in 2.5D/3D packaging as well as those associated with the production of advanced IC substrate as manufacturers target finer feature sizes and prepare for the transition from organic to glass core material. Innovative solutions in metrology, inspection, panel lithography and yield management software will be presented. This forum will offer fab managers, process engineers and tool owners the opportunity to learn, discuss and share practical knowledge about process control technology specific to packaging for high performance applications.