Mar 13 — Mar 16, 2023 Fountain Hills, AZ

Advanced IC Substrate Deformation and Pattern Distortion Analysis to Validate the Use of an Extremely Large Exposure Field Fine-Resolution Lithography solution

Keith Best

Keith Best

Presentation at iMAPS 19th International Conference & Exhibition on Device Packaging
9:00am — 5:00pm

Advanced IC Substrate Deformation and Pattern Distortion Analysis to Validate the Use of an Extremely Large Exposure Field Fine-Resolution Lithography solution is authored by Onto Innovation's John Chang with presentation at the event by Keith Best.