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Screenshot 2026-06-04 154559
Moving Defect Detection And Classification To The Edge

The number of defects detected through inspection is exploding at each new process node. There are now millions of defects being identified on each wafer, but only a fraction of those can cause problems.

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Screenshot 2026-06-04 154559
Moving Defect Detection And Classification To The Edge
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Upcoming Events
semitaiwan-18-2
SEMICON Taiwan
Posted on Mar 14, 2024

How AI is Helping Optimize AI Chip Production

from Semiconductor Digest
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Onto Innovation’s Monita Pau and Prasad Bachiraju contribute to the March 2024 edition of Semiconductor Digest.

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