Aspect® System
Advanced infrared optical critical dimension (IRCD) metrology system for high aspect ratio structures in 3D NAND, 2D & 3D DRAM, CIS and power devices.
Artificial Intelligence (AI)
Explore how AI, high performance computing and big data are transforming technology, and learn how Onto Innovation supports these trends with advanced inspection, metrology, lithography and analytics.
AI
AI adoption is accelerating at an unprecedented pace, transforming industries from healthcare to finance. This explosive growth demands increasingly powerful semiconductor chips capable of processing massive datasets at lightning speed. However, producing these AI-optimized chips presents complex challenges in logic, memory, packaging and power.
Onto Innovation is at the forefront of enabling AI through advanced inspection, metrology and lithography systems. Our solutions support the fabrication of next-generation logic devices like Gate-All-Around (GAA) and FinFET architectures—essential for delivering the speed and efficiency AI workloads require. We also help enable high-bandwidth memory and stacked DRAM, which provide the essential memory capacity for large-scale AI models. Lithography plays a pivotal role in panel-level packaging by enabling the precise patterning of dense interconnects that connect logic, memory and chiplets.
To further elevate AI chip manufacturing, our disruptive software solutions deliver predictive insights and actionable intelligence across nearly every process area, unlocking the full potential of your data.
High Performance Computing
High Performance Computing (HPC) is driving breakthroughs in AI, scientific research and data-intensive applications. As demand grows for faster, more efficient processing, the semiconductor industry is pushing the limits of memory, packaging and power technologies.
Onto Innovation plays a pivotal role in enabling HPC through advanced metrology and inspection solutions. We support cutting-edge memory technologies like high-bandwidth memory and next-gen stacked DRAM. Our deep expertise in advanced packaging enables precise 3D bump metrology, RDL printing and inspection—covering the majority of interconnects critical to HPC performance. We’re also leading innovation in panel-level packaging through collaborative development at our Packaging Application Center of Excellence, where we’re pioneering solutions to support next generation glass substrates.
Power efficiency is essential to HPC. Our process control technologies support compound semiconductors that drive high-performance systems.
Big Data
Big data continues to reshape industries by enabling real-time analytics, AI, and smarter decision-making. This trend is fueled by the explosion of data from connected devices, cloud platforms and advanced applications. At the core of this evolution is the need for high-performance computing, driven by innovations in semiconductor technology.
Onto Innovation helps to accelerate this transformation by delivering metrology and inspection solutions that support the development of advanced logic and memory. Our technologies enable innovations like Gate-All-Around (GAA) and FinFET architectures in logic, as well as DRAM in memory, ensuring precision and reliability at nanoscale dimensions. We also enable compound semiconductor applications in power, analog, RF, laser and photonics.
Our technology extends to our powerful analytics software that connects data across tools, factories, and global supply chains—unlocking actionable insights and maximizing the value of your most critical asset: your data.
Atlas® V System
High performance OCD and thin film metrology for advanced GAA and memory devices.
Celero™ PL System
Subsurface defect and crystalline defect inspection and classification in bulk and epitaxial III-V materials for application in power semiconductors.
Discover® AI Software
A cutting-edge AI engine built for semiconductor manufacturing, providing actionable predictions and insights across nearly any process area.
Discover® Patterns Software
Revealing signals hidden in everyday noise.
Discover® Yield Software
An advanced yield analysis toolkit that seamlessly integrates data from your entire enterprise, helping to prevent loss and better understand your process needs.
Dragonfly® G3 System
Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
Echo™ System
Opto-acoustic film metrology for in-line, non-contact, non-destructive single and multi-layer metal film thickness measurements and material characterization on 150, 200, and 300mm substrates.
Firefly® G3 System
Sub-micron automatic defect inspection with integrated 3D metrology for advanced IC substrates and panel level packaging.
IMPULSE® V System
Advanced high throughput integrated metrology system with AI-driven machine learning option. The system offers maximum sensitivity and accuracy to CMP process excursions and enables process engineers to establish APC control with high-accuracy feedback.
Iris™ G2 System
A high throughput common and critical thin film optical system for advanced and mature node devices.
IVS 380 System
Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.
JetStep® S3500 System
Advanced packaging lithography system designed for fan-out panel level packaging, accommodating substrates up to 720mm x 600mm
JetStep® X500 System
Designed for advanced integrated circuit substrates (AICS) and other advanced packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm L/S resolution with a large depth of focus.
NovusEdge® G2 System
Unpatterned edge, notch and backside inspection.
OCD Solutions
A suite of OCD modeling software and computing hardware offering comprehensive capabilities for inline metrology, offline recipe creation and fleet management.
PrecisionWoRx® VX4 System
Wafer probe card test and analysis system.
PrimaScan™ P System
All-surface defect and contamination inspection for unpatterned glass panel substrates with imaging capability for panels up to 600x600mm in size.
PrimaScan™ R&D System
All-surface defect and contamination inspection for unpatterned wafer and blanket films, with imaging capability for opaque, transparent and semi-transparent wafers, reticles and piece parts.
PrimaScan™ System
All-surface defect and contamination inspection for unpatterned wafer and blanket films, with imaging capability for opaque, transparent and semi-transparent wafers, reticles and piece parts.
StepFAST® Software
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
TrueADC® Software
Automated defect classification software with deep learning, real defect modeling and seamless integration with Onto AOI tools.
Yield Optimizer™ Software
Machine learning built with semiconductor manufacturing in mind.
Bridging Performance and Yield: The Evolving Role of Interconnect Technologies in HBM
Challenges in Stacking HBM
Enabling In-Line Process Control for Hybrid Bonding Applications
Using Picosecond Ultrasonic Technology for AI Packages, Part 2
3D InCites Members Reveal Breakthrough Technologies at ECTC 2025
Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
Advanced Interconnect Process Control with Picosecond Ultrasonic Technology for AI Device Packaging
Measuring Multi-Layer Ultra-Thin Critical Films
Getting The Biggest ROI On Your Digital Twin
Achieving Zero Defect Manufacturing Part 1: Detect & Classify
Using 2D/3D Technology to Overcome Challenges of Large-Area Panel Inspection and Metrology
Using Automatic Defect Classification to Reduce the Escape Rate of Defects
How AI is Helping Optimize AI Chip Production
Using Deep Learning ADC for Defect Classification for Automatic Defect Inspection
Using Advanced Analytics To Meet ESG Goals
Addressing Yield Challenges in Advanced IC Substrate (AICS) Packaging
Using Machine Learning to Increase Yield and Lower Packaging Costs
Heterogeneous Integration: Correcting Overlay Errors On Advanced Integrated Circuit Substrates (AICS)
Heterogeneous Integration: Exposing Large Panels with Fewer Shots
Center Stage: The time for hybrid bonding has arrived
Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography
Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography
Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging
What Does It Take To Build A Successful Multi-Chip Module Factory?
How Do Machines Learn?
Demystifying ADC
The Big Squeeze – Why OSATs Need to Work Smarter
Revealing Invisible Defects on Large 600mm Panels
Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: Inspection and Metrology
Overcoming FOPLP Die Placement Error
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