When it comes to data accessibility, the terms “secure” and “share” seem like two diametrically opposed words. Conventional wisdom would suggest that any effort to secure data would involve limiting access to that data, while sharing data would involve opening up access to that data for others to view and use.

As it turns out, semiconductor operations need to do both.

On the one hand, semiconductor companies often need to share data so others can leverage data for problem solving and improve their overall manufacturing processes. On the other, these companies need to know their data is secure and free from data leaks resulting in lost IP or negating a competitive advantage. The solution: secured data sharing.

All great voyages must come to an end. Such is the case with our series on the challenges facing the manufacturing of advanced IC substrates (AICS), the glue holding the heterogeneous integration ship together.

In our first blog, we examined how cumulative overlay drift from individual redistribution layers could significantly increase overall trace length, resulting in higher interconnect resistance, parasitic effects and poor performance for high-speed and high-frequency applications. To address this, layer to layer overlay performance data needs to be monitored at each layer. If the total overlay error exceeds specifications at any process step, and at any location on the panel, corrective action must be taken to mitigate the drift in total overlay.

For this second installment, we explored the issue of AICS package yield and its importance in fostering a cost-effective, production-worthy process. Unlike most fan-out panel-level packaging (FOPLP) applications, AICS has relatively few packages per panel. This enormous disparity impacts yield calculations dramatically. In the AICS production process, the main challenge is the real-time tracking of yield for every panel, at every layer, throughout the fab. The solution: using advanced automatic defect classification (ADC) and yield analytics to quickly address errors.

In this final article of the series, we explore how overlay correction solutions compensate for panel distortion effects induced by copper clad laminate (CCL) processing, which impacts yield and final package performance.

In our previous blog, I talked about the essential factors that a company must consider in leveraging cloud resources to accelerate their goals. The objective here is not just about putting some of the workload in the cloud; rather, it is about realizing the transformation adopting cloud technologies will bring about. In particular, it is more important to think of the cloud not only as a set of infinitely scalable services and resources but as the underlying technologies and best practices that can be adopted as a framework for your software architecture in general. While I don’t mean to belabor the point, adopting the cloud in a manner where it can truly unlock operational efficiencies and leverage its advantages is truly an organizational change.

Business strategy

You’re unlikely to see the phrase “we want to use cloud more” in any organization’s strategic plans. However, the cloud can play a strategic role in expediting innovation; optimizing and reducing IT costs; helping a company meet the scalability demands required as new services, products or markets are launched; and making data accessible and actionable across disciplines in the organization. The cloud can assist with predictive maintenance, supply chain transparency, testing, quality, process automation and smart manufacturing. The chart from Accenture below captures the broad areas where the cloud can be leveraged easily in support of an organization’s goals (Fig 1).