The 4Di InSpec Automated Measurement System is a non-contact optical surface gauge, either the 4D InSpec or 4D InSpec XL, integrated with a choice of collaborative robots, an optional rotary table and a safety cell for rapid production inspection.

This fully automated 3D optical system can measure dozens of edge break features, chamfers, and radii in minutes, vastly improving throughput and driving down inspection costs.

Designed as a turnkey cell for quality control, it is ideal for precision machined components such as turbine blades and rotors, air foils, high pressure compressor blades, blisks and dovetails. The high resolution system can measure in any orientation, on curved surfaces, over large and complex geometries, and in tight spaces or blind locations.

The 4Di InSpec AMS accurately captures complex feature dimensions, enabling more precise part disposition. Its rapid measurement capabilities reduce inspection queuing times, while the ability to measure at multiple locations in the same timeframe ensures part quality.

The 4Di InSpec optical surface gauge is the first handheld precision instrument designed for non-contact surface defect measurement. With micrometer-level resolution, portability, affordability and ease-of-use, the 4Di InSpec surface gauge brings high resolution 3D surface measurement where it’s needed: on the factory floor, in machine shops, and in field service applications.

This surface gauge provides 3D surface measurements to instantly quantify defects and features up to 100 mils (2,540 micrometers) deep. Without the need for replication, it can measure large components of varying complex geometries directly. It is adaptable for handheld use, workstation setups, or robotic operation with optional accessories to meet specific customer challenges.

Even with its incredible precision and extensive analysis capabilities, its ease of use allows non-experts to take measurements after just minutes of training.

The NSX 330 system features robust platform technology with high-acceleration staging, high-speed multi-processor computing and flexible software. With over 1,000 installation worldwide, the NSX 330 System offers 2D inspection and metrology at high throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications. These include wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.

Accommodating wafers from 100mm to 330mm, the system features a versatile objective turret, programmable light tower, and multiple dark field illumination modes. Additional features include resolution flexibility, unique handling solutions, and comprehensive software for recipe sharing and offline analysis. The NSX 330 system, with optional edge and backside inspection via the EB40 module, provides a comprehensive all-surface inspection solution packaging technology challenges.

The Celero PL system utilizes a laser-based phase detection and imaging capability that leverages custom optics and image processing algorithms to enable best in class throughput and sensitivity for silicon carbide and gallium nitride-based materials on 100mm to 300mm wafer sizes. Leveraging multiple light sources and sensor channels, the system can detect, measure and image a broad variety of subsurface crystalline defects, associated with bulk wafers and epitaxial layers, surface particles, scratches, pits, surface contamination, stains, point or bulk wafer stress, voids/inclusions, including chips and cracks at the edge of the wafer.

The Dragonfly G3 is a widely adopted pattern inspection system that utilizes line scan imaging technology to deliver fast, sub-micron defect detection for both R&D and high volume manufacturing environments. It features multiple illumination channels, including brightfield, darkfield, high-speed IR for embedded defects, and Clearfind^® technology for detecting non-visual organic residues. Powered by modern machine learning algorithms, the Dragonfly G3 system offers a complete on-tool solution for defect detection, nuisance reduction and classification.

The system offers additional flexibility through the integration of multiple 3D metrology capabilities, including film thickness and structural profiling, and substrate thickness measurement. It features the latest 3Di^™ technology, delivering and precise bump height metrology. The Dragonfly G3 system, with optional edge and backside inspection via the EB40 module, offers a comprehensive all-surface inspection solution for both front-end and back-end OQA.

The NovusEdge G2 System provides high sensitivity inspection for the edge and backside of unpatterned wafers for current and advanced nodes. Configurable modules on the same automation platform increase throughput while maintaining a small footprint for improved cost of ownership. The edge-gripping handling solution for both automation platform and the inspection modules provide desired cleanliness required for manufacturing. Optional high-sensitivity notch inspection can be added. Defects are automatically classified and binned at run time to reduce manual review.

Designed as a multipurpose inspection and sorting system for end of line outgoing quality inspection of 300mm unpatterned wafers, the system identifies, inspects and sorts wafers according to recipes.

The NovusEdge G2 system offers higher sensitivity than the previous generation, with sub-micron resolution and increased throughput by over 15%. User interaction is simplified, and the new electrical design consumes less power.