Discover Yield software helps reduce the time it takes to find root causes of yield excursions and enables manufacturers to broaden their analysis scope for better yield management.

The software includes data acquisition and integration, a development environment through workflow and scripting, and specialized analysis algorithms to identify domain-specific issues, such as data mining, spatial anomalies, wafer processing sequence problems, commonality of effects, system and random yield loss, chamber matching, tool events, traceability and more. In addition, Discover Yield software provides distinct tools – principal components and multivariate analysis of variance (MANOVA) – that allow systematic, simultaneous examination of multiple variables. Discover Yield software’s database architecture for genealogy uniquely supports value chain predictive analytics.

Improving baseline yield with analytics

StepFAST® software is Onto Innovation’s advanced lithography software solution tailored for fan-out panel-level packaging, where die placement errors and material instability can significantly impact yield and productivity. StepFAST® software uses a feed-forward adaptive shot approach, integrating high-speed die placement measurements from the Firefly® system and applying real-time corrections to every shot of the JetStep® lithography tool. This external measurement strategy doubles throughput compared to traditional on-tool (self-metrology) methods. The software also incorporates predictive yield analysis, enabling dynamic adjustment of exposure field sizes to balance throughput and overlay accuracy. By automating reticle selection and optimizing field coverage, StepFAST® software ensures efficient panel exposure while minimizing registration errors—from ±50µm down to under ±3µm. With advanced analytics, StepFAST® software transforms lithography into a flexible, high-efficiency process, delivering substantial improvements in yield, throughput, and cost of ownership for panel-level packaging applications.

The JetStep X500 panel lithography system is optimized for high volume manufacturing of high-end AICS and other advanced packaging panel applications. As we approach the limits of Moore’s law, the JetStep X500 system addresses the need for extremely large packages integrating multi-node chips, or “chiplets,” enhancing functionality, speed, I/O count and reducing power consumption for server farms, AI, and mobile applications. The JetStep X500 system features the industry’s largest exposure field , fine line RDL resolution with large depth of focus (DOF), excellent overlay accuracy, and automatic magnification compensation with independent x and y magnification adjustment. The JetStep X500 system handles a large range of substrate thicknesses with high levels of warp, offering unique imaging parameter control to compensate for panel distortion. Additionally, it can run highly warped substrates with an edge clamping option and provides real-time autofocus at every exposure site to compensate for challenging topography.

The JetStep S3500 panel lithography system is specifically designed for advanced packaging panel production. As fan-out packages increase in size and complexity, requiring panel substrates instead of wafers, the JetStep S3500 system addresses these challenges with advanced features. It handles die shift caused by placement accuracy errors, CTE mismatch and panel warpage. The system incorporates a large exposure field (59.4 x 59.4mm) with resolution capability to 2/2 L/S and options for increased resolution to 1/1. In addition, it supports multiple exposure wavelengths, ideal for process development with new photosensitive polymers. Application-specific options include warped panel handling, “on-the-fly” optical focus, and die shift correction (StepFAST^™ Solution), helping to ensure precise and reliable panel-level packaging.

Discover AI software is a disruptive technology that reshapes the way we approach manufacturing line control and yield analysis. It leverages the latest in machine learning and artificial intelligence to identify actionable improvements and connections in data that a human could not. The software’s optimization engine adds a powerful machine learning analytical method to an already sophisticated toolbox of process improvement applications.

By analyzing any set of conceivable inputs and outputs, Discover AI software identifies relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

Discover AI software evaluates multiple models and suggests the optimal one for the data. Using machine learning, it examines interactions between in-process inputs and results for any semiconductor product family and recommends changes to in-process targets. Licensed as a service, it enables users to leverage an on-demand infrastructure to apply easily understood workflows for complex analytics without the overhead.

The IVS 380 is an optical overlay, CD & z-height metrology system designed for high volume manufacturing, with SMIF (200mm substrate) or FOUP (300mm substrate) load ports compatibility. It handles various substrates for advanced packaging, including Si, glass and CCL, and accommodates sizes of 200mm and 300mm.

Building on the IVS family’s 40 years of experience in CMOS, MEMS and compound semiconductor applications, the IVS 380 system possesses the versatility to tackle overlay, CD and z-height measurements for diverse substrates and layers. It measures critical dimensions in the xy plane and the vertical z-heights of features like RDL metal lines, posts and bumps. The optics enable focus on mostly transparent materials such as photoresists and rough surfaces such as electroplated copper.