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Firefly® G3 System

The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.

Firefly® G3 System

Product Overview

The Firefly G3 platform offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique to detect residue defects on metal and metal defects on organic layers. The combination of high sensitivity inspection, 2D/3D metrology and on tool color image capture capability in a single platform reduces capital investment requirements and provides a reliable pathway for panel-based process applications that require high I/O counts and multiple-chip integration.

Integration with Onto Innovation’s Discover® Defect and TrueADC® software quickly turns defect data into actionable process control, improves defect classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.

Applications

  • Advanced IC Substrates (AICS): CCL and Glass
  • Fan-out Panel Level Packaging (FOPLP)
  • Interposers
  • Embedded Die substrates/ Interposer
  • 2.5D/3D integration
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Do you have a Firefly G3 system question? Let’s talk!

As your partner for innovative solutions, we’re always here for you.

Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.

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