Firefly® G3 System
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
Product Overview
The Firefly G3 platform offers multiple imaging modes, including Onto Innovation’s patented Clearfind® Technology, a technique to detect residue defects on metal and metal defects on organic layers. The combination of high sensitivity inspection, 2D/3D metrology and on tool color image capture capability in a single platform reduces capital investment requirements and provides a reliable pathway for panel-based process applications that require high I/O counts and multiple-chip integration.
Integration with Onto Innovation’s Discover® Defect and TrueADC® software quickly turns defect data into actionable process control, improves defect classification and reduces manual review. It enables our customers to develop, learn and analyze new processes reliably while significantly improving their product delivery time to market.
Applications
- Advanced IC Substrates (AICS): CCL and Glass
- Fan-out Panel Level Packaging (FOPLP)
- Interposers
- Embedded Die substrates/ Interposer
- 2.5D/3D integration
Featured Markets
Adaptive Shot Lithography Solution
Die shift on reconstituted panels can significantly impact both productivity and yield. To address this challenge, we use a parallel die placement measurement process and advanced analytics to provide a means to balance productivity against yield. Our integrated lithography cell, featuring Firefly inspection, StepFAST software, and JetStep Lithography, delivers industry-leading throughput and yield for fan-out panel level packaging.
Overcoming FOPLP Die Placement Error
It is well understood that advanced packaging applications require high performance, low cost, increased functionality and improved reliability that 2.5D and 3D packaging solutions provide. Fan-out panel-level packaging (FOPLP) is one of the technologies that has the potential to meet these packaging requirements.
JetStep® S3500 System
The JetStep S3500 system is designed to provide OSATS with a high-volume manufacturing advanced packaging lithography solution. For substrates up to 720mm x 600mm, it supports fan-out panel level packaging.
JetStep® X500 System
The JetStep X500 system is designed to provide AICS and OSAT manufacturers with a high-volume manufacturing lithography solution for heterogeneous integration. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
Firefly® G3 System
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
StepFAST® Software
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
Adaptive Overlay Control
During the processing of organic (CCL) advanced IC substrates (AICS) the substrates become distorted which impacts the overlay of Via to RDL pad structures. To solve this problem, the stepper must adjust the alignment solution to match the previous layer’s distortion by measuring the overlay. Proprietary software provides the user with the ability to adjust each zone of the AICS with independent offsets.
Analysis of Pattern Distortion by Panel Deformation
The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and internet of things (IoT) applications. Next generation packaging technologies require tighter overlay to accommodate larger package sizes with fine-pitch chip interconnects on large-format flexible panels.
JetStep® X500 System
Designed for advanced IC substrates (AICS), it incorporates a large field exposure area with a large depth of focus. Proprietary software enables independent zone offset adjustments across the AICS.
Firefly® G3 System
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
Discover® Defect Software
Discover® Review Software
StepFAST® Software
Through the Glass: Why the Rapid Development of TGV Demands Rigorous Analysis
The Innovations Driving the Advanced Packaging Roadmap, Part 1
Onto Innovation’s PACE Partners Talk About Collaborating on Panel-Level Packaging
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
The Long Climb: Bringing Through Glass Vias (TGV) to High-Volume Manufacturing
Using 2D/3D Technology to Overcome Challenges of Large-Area Panel Inspection and Metrology
How AI is Helping Optimize AI Chip Production
Optimizing Advanced IC Substrates (AICS) for PLP
The Glass Substrate Question: When Will It Replace Copper Clad Laminate?
Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections
Illumination Inspection Technology for Defect Detection on Advanced IC Substrates
Addressing Total Overlay Drift In Advanced IC Substrate (AICS) Packaging
Nip the Defect in the Bud: Using an external inspection system and FDC software increases ABF substrate yield
Outlier Control Technology and Feedforward Lithography Can Boost FOPLP Yield
Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography
Revealing Invisible Defects on Large 600mm Panels
Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
Overcoming FOPLP Die Placement Error
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