Dragonfly® G3 System
The Dragonfly G3 system is resetting the industry’s expectations for throughput, accuracy and reliability. Combining 2D and 3D technologies, the system detects yield-robbing defects and measures features critical for today’s semiconductor technologies
Product Overview
The Dragonfly G3 is a widely adopted pattern inspection system that utilizes line scan imaging technology to deliver fast, sub-micron defect detection for both R&D and high volume manufacturing environments. It features multiple illumination channels, including brightfield, darkfield, high-speed IR for embedded defects, and Clearfind® technology for detecting non-visual organic residues. Powered by modern machine learning algorithms, the Dragonfly G3 system offers a complete on-tool solution for defect detection, nuisance reduction and classification.
The system offers additional flexibility through the integration of multiple 3D metrology capabilities, including film thickness and structural profiling, and substrate thickness measurement. It features the latest 3Di™ technology, delivering and precise bump height metrology. The Dragonfly G3 system, with optional edge and backside inspection via the EB40 module, offers a comprehensive all-surface inspection solution for both front-end and back-end OQA.
Applications
- Redistribution layers (RDL): after develop, after etch
- Reconstructed and bonded wafers
- Micro bumps and Cu pillars
- Post saw
- Gel and waffle pack inspection
- Post probe and testing
- OQA
Featured Markets
Hybrid Bonding Process Control Solution
Hybrid bonding enables ultra-dense 3D memory interconnects with up to 1,000x more connections than microbumps. Achieving high yield requires stringent process control, including monitoring topography and detecting particles, cracks and voids. Measuring dishing in copper pads provides valuable insight into surface conditions. Together, these process control insights contribute to improved device reliability and performance.
Enabling In-Line Process Control for Hybrid Bonding Applications
As demand grows for high-performance computing (HPC) and AI-driven applications, manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip architectures. This advanced packaging technology presents significant process challenges. Surface preparation must be precisely controlled to eliminate particles, excess recess, and copper pad dishing, all of which can compromise bond quality. During pre-annealing, particle-induced gaps and wide bonding gaps can prevent proper wafer contact. Post-annealing, the formation of dielectric and metal voids introduces further risks to electrical performance and long-term reliability.
Iris™ S System
The Iris S system is a versatile platform solution for the advanced packaging and specialty market, supporting 150mm, 200mm and 300mm wafers. It provides thin and thick film, OCD and wafer bow and film stress measurements.
IMPULSE® V System
The IMPULSE V system helps to advance CMP processing with enhanced wavefront technology and AI-driven analytics, delivering over 2X precision improvement and faster solutions, crucial for next-gen semiconductor manufacturing demands.
Dragonfly® G5 System
The Dragonfly G5 system is engineered for inline process control of leading-edge advanced packaging technologies. As the latest generation pattern inspection system in the Dragonfly series, it delivers unparalleled accuracy in detecting submicron defects and performing high-resolution 3D measurements.
Aspect® System
The Aspect System is a revolutionary in-line, non-destructive infrared optical critical dimension (IRCD) system measuring Z-dimension profiling of high aspect ratio structures to enable critical process control. It meets the needs of leading-edge customers with its high speed and process coverage.
Dragonfly® G5 System
EB40™ Module
Discover® Defect Software
Discover® Review Software
TrueADC® Software
Inspection Tool Productivity Software
Enabling In-Line Process Control for Hybrid Bonding Applications
Addressing The Challenges of Metrology for Advanced Packaging
How AI is Helping Optimize AI Chip Production
The Age of Hybrid Bonding: Where We Are and Where We’re Going
Center Stage: The time for hybrid bonding has arrived
Addressing The ABF Substrate Shortage With In-Line Monitoring
In The Spotlight: What Is Responsible For The Surging Demand For CIS?
Understanding Optical Inspection For CIS
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