AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development.
The JetStep X500 system is designed to provide AICS and OSAT manufacturers with a high-volume manufacturing lithography solution for heterogeneous integration. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
The JetStep X500 panel lithography system is optimized for high volume manufacturing of high-end AICS and other advanced packaging panel applications. As we approach the limits of Moore’s law, the JetStep X500 system addresses the need for extremely large packages integrating multi-node chips, or “chiplets,” enhancing functionality, speed, I/O count and reducing power consumption for server farms, AI, and mobile applications. The JetStep X500 system features the industry’s largest exposure field , fine line RDL resolution with large depth of focus (DOF), excellent overlay accuracy, and automatic magnification compensation with independent x and y magnification adjustment. The JetStep X500 system handles a large range of substrate thicknesses with high levels of warp, offering unique imaging parameter control to compensate for panel distortion. Additionally, it can run highly warped substrates with an edge clamping option and provides real-time autofocus at every exposure site to compensate for challenging topography.
Die shift on reconstituted panels can significantly impact both productivity and yield. To address this challenge, we use a parallel die placement measurement process and advanced analytics to provide a means to balance productivity against yield. Our integrated lithography cell, featuring Firefly inspection, StepFAST software, and JetStep Lithography, delivers industry-leading throughput and yield for fan-out panel level packaging.
It is well understood that advanced packaging applications require high performance, low cost, increased functionality and improved reliability that 2.5D and 3D packaging solutions provide. Fan-out panel-level packaging (FOPLP) is one of the technologies that has the potential to meet these packaging requirements.
The JetStep S3500 system is designed to provide OSATS with a high-volume manufacturing advanced packaging lithography solution. For substrates up to 720mm x 600mm, it supports fan-out panel level packaging.
The JetStep X500 system is designed to provide AICS and OSAT manufacturers with a high-volume manufacturing lithography solution for heterogeneous integration. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
During the processing of organic (CCL) advanced IC substrates (AICS) the substrates become distorted which impacts the overlay of Via to RDL pad structures. To solve this problem, the stepper must adjust the alignment solution to match the previous layer’s distortion by measuring the overlay. Proprietary software provides the user with the ability to adjust each zone of the AICS with independent offsets.
The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and internet of things (IoT) applications. Next generation packaging technologies require tighter overlay to accommodate larger package sizes with fine-pitch chip interconnects on large-format flexible panels.
Designed for advanced IC substrates (AICS), it incorporates a large field exposure area with a large depth of focus. Proprietary software enables independent zone offset adjustments across the AICS.
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
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The JetStep S3500 system is designed to provide OSATS with a high-volume manufacturing advanced packaging lithography solution. For substrates up to 720mm x 600mm, it supports fan-out panel level packaging.
The JetStep S3500 panel lithography system is specifically designed for advanced packaging panel production. As fan-out packages increase in size and complexity, requiring panel substrates instead of wafers, the JetStep S3500 system addresses these challenges with advanced features. It handles die shift caused by placement accuracy errors, CTE mismatch and panel warpage. The system incorporates a large exposure field (59.4 x 59.4mm) with resolution capability to 2/2 L/S and options for increased resolution to 1/1. In addition, it supports multiple exposure wavelengths, ideal for process development with new photosensitive polymers. Application-specific options include warped panel handling, “on-the-fly” optical focus, and die shift correction (StepFAST™ Solution), helping to ensure precise and reliable panel-level packaging.
Die shift on reconstituted panels can significantly impact both productivity and yield. To address this challenge, we use a parallel die placement measurement process and advanced analytics to provide a means to balance productivity against yield. Our integrated lithography cell, featuring Firefly inspection, StepFAST software, and JetStep Lithography, delivers industry-leading throughput and yield for fan-out panel level packaging.
It is well understood that advanced packaging applications require high performance, low cost, increased functionality and improved reliability that 2.5D and 3D packaging solutions provide. Fan-out panel-level packaging (FOPLP) is one of the technologies that has the potential to meet these packaging requirements.
The JetStep S3500 system is designed to provide OSATS with a high-volume manufacturing advanced packaging lithography solution. For substrates up to 720mm x 600mm, it supports fan-out panel level packaging.
The JetStep X500 system is designed to provide AICS and OSAT manufacturers with a high-volume manufacturing lithography solution for heterogeneous integration. The JetStep X500 system exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.
The Firefly G3 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
As your partner for innovative solutions, we’re always here for you.
Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
"*" indicates required fields