The F30 automated defect inspection system combines high resolution and throughput to drive fab yield and productivity. A five-objective turret enables resolution-throughput flexibility, while its multi-channel illumination including brightfield, darkfield, high-angle ring light, and IR-Review addresses the requirements for today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations. The system can handle 100mm – 300mm wafers can be paired with the edge and backside module (EB40) to provide an all-surface inspection solution.

The Celero PL system utilizes a laser-based phase detection and imaging capability that leverages custom optics and image processing algorithms to enable best in class throughput and sensitivity for silicon carbide and gallium nitride-based materials on 100mm to 300mm wafer sizes. Leveraging multiple light sources and sensor channels, the system can detect, measure and image a broad variety of subsurface crystalline defects, associated with bulk wafers and epitaxial layers, surface particles, scratches, pits, surface contamination, stains, point or bulk wafer stress, voids/inclusions, including chips and cracks at the edge of the wafer.

The PrimaScan R&D system offers a smaller spot size and higher pixel resolution than its high volume production counterpart tools. The flexibility in sample handling options combined with the multiple sensing channels and higher resolution imaging makes this the ideal tool for R&D and lab environments. Similar to the other tools in the PrimaScan line, the PrimaScan R&D system offers reliable inspection of nanometer sized defects on a variety of opaque and transparent/semi-transparent substrates and samples suitable for either R&D or lab environments. The system can detect, measure, characterize and image surface particles, scratches, pits, bumps, surface contamination, film or bulk wafer stress, voids/inclusions, including chips and cracks at the wafer edge.

Designed with versatility in mind the PrimaScan R&D system can handle a variety of wafer sizes and substrate types including film frame, photomask and sample tray.

The Class 1 certified EB40 module offers combined edge and backside inspection and is also available as separate edge (E40) and backside (B40) modules. These modules provide brightfield and darkfield inspection to detect defects on the entire bevel and backside, covering Zone 1 to Zone 5. This enables faster root-cause analysis of defects that can migrate to the wafer interior, impacting die yield.

The EB40 module captures defect images on the fly, creates whole-wafer composite images, and integrates with SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using Discover Defect software. Correlating EBR metrology with defectivity data, SEM data and micro-inspection results is just the beginning of what Discover software can do. In addition to advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software.

The Dragonfly G3 system utilizes line scan-based 2D imaging technology to provide fast, reliable inspection for sub-micron defects, meeting both current R&D and future production needs. It features multi-illumination channels, including brightfield/darkfield, high-speed IR for embedded defects and Clearfind® Technology for non-visual residue detection. For specialty markets like CMOS image sensors (CIS), it uses oblique angle illumination, sophisticated image processing and machine-learning algorithms to detect low contrast defects in the active pixel sensor area.

Optional 3D metrology sensors include the latest 3Di^™ technology, delivering fast, precise bump height metrology. Discover Software visualizes the massive amounts of bump data, correlating process variations to improve yields. TrueADC software enables real time automatic classification of critical defects and reduces nuisance defects. The Dragonfly G3 system, with optional edge and backside inspection via the EB40 module, offers a comprehensive all-surface inspection solution for next generation technology challenges.