Dragonfly® G3 System
Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
EB40™ Module
The EB40 Module combines edge and backside inspection into one tool with the option to be paired with an inspection system to provide a high throughput all surface inspection solution.
Product Overview
The Class 1 certified EB40 module offers combined edge and backside inspection and is also available as separate edge (E40) and backside (B40) modules. These modules provide brightfield and darkfield inspection to detect defects on the entire bevel and backside, covering Zone 1 to Zone 5. This enables faster root-cause analysis of defects that can migrate to the wafer interior, impacting die yield.
The EB40 module captures defect images on the fly, creates whole-wafer composite images, and integrates with SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using Discover Defect software. Correlating EBR metrology with defectivity data, SEM data and micro-inspection results is just the beginning of what Discover software can do. In addition to advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software.
Applications
- EDGE INSPECTION
- Lithography process monitoring
- Cracks/Chips, Slurry, cleaning contaminants and residual films
- EBR Metrology
- Bonded wafer adhesive inspection
- BACKSIDE INSEPCTION
- Scratches
- Chuck and end effector signatures
- Backside particles and residues
- Wafer level pattern detection
Featured Markets
F30™ System
Advanced macro inspection for front-end manufacturers.
NSX® 330 System
2D automated defect inspection and sample 3D inspection for advanced packaging.
Discover® Defect Software
Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
Discover® Review Software
Your smart factory’s human classification interface.
Enabling In-Line Process Control for Hybrid Bonding Applications
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Dragonfly® G3 System
The Dragonfly G3 system is resetting the industry’s expectations for throughput, accuracy and reliability. Combining 2D and 3D technologies, the system detects yield-robbing defects and measures features critical for today’s front-end and packaging technologies.
Product Overview
The Dragonfly G3 system utilizes line scan-based 2D imaging technology to provide fast, reliable inspection for sub-micron defects, meeting both current R&D and future production needs. It features multi-illumination channels, including brightfield/darkfield, high-speed IR for embedded defects and Clearfind® Technology for non-visual residue detection. For specialty markets like CMOS image sensors (CIS), it uses oblique angle illumination, sophisticated image processing and machine-learning algorithms to detect low contrast defects in the active pixel sensor area.
Optional 3D metrology sensors include the latest 3Di™ technology, delivering fast, precise bump height metrology. Discover Software visualizes the massive amounts of bump data, correlating process variations to improve yields. TrueADC software enables real time automatic classification of critical defects and reduces nuisance defects. The Dragonfly G3 system, with optional edge and backside inspection via the EB40 module, offers a comprehensive all-surface inspection solution for next generation technology challenges.
Applications
- Redistribution layers (RDL): after develop, after etch
- Reconstituted and bonded wafers
- Micro bumps and Cu pillars
- Post saw
- Gel and waffle pack inspection
- Post probe and testing
- OQA
Hybrid Bonding Process Control Solution
Hybrid bonding enables ultra-dense 3D memory interconnects with up to 1,000x more connections than microbumps. Achieving high yield requires stringent process control, including monitoring topography and detecting particles, cracks and voids. Measuring dishing in copper pads provides valuable insight into surface conditions. Together, these process control insights contribute to improved device reliability and performance.
Enabling In-Line Process Control for Hybrid Bonding Applications
As demand grows for high-performance computing (HPC) and AI-driven applications, manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip architectures. This advanced packaging technology presents significant process challenges. Surface preparation must be precisely controlled to eliminate particles, excess recess, and copper pad dishing, all of which can compromise bond quality. During pre-annealing, particle-induced gaps and wide bonding gaps can prevent proper wafer contact. Post-annealing, the formation of dielectric and metal voids introduces further risks to electrical performance and long-term reliability.
Iris™ S System
The Iris S system is a versatile platform solution for the advanced packaging and specialty market, supporting 150mm, 200mm and 300mm wafers. It provides thin and thick film, OCD and wafer bow and film stress measurements.
IMPULSE® V System
The IMPULSE V system helps to advance CMP processing with enhanced wavefront technology and AI-driven analytics, delivering over 2X precision improvement and faster solutions, crucial for next-gen semiconductor manufacturing demands.
Dragonfly® G3 System
The Dragonfly G3 system is resetting the industry’s expectations for throughput, accuracy and reliability. Combining 2D and 3D technologies, the system detects yield-robbing defects and measures features critical for today’s front-end and packaging technologies.
Aspect® System
The Aspect System is a revolutionary in-line, non-destructive infrared optical critical dimension (IRCD) system measuring Z-dimension profiling of high aspect ratio structures to enable critical process control. It meets the needs of leading-edge customers with its high speed and process coverage.
EB40™ Module
Edge and backside inspection.
Discover® Defect Software
Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
Discover® Review Software
Your smart factory’s human classification interface.
TrueADC® Software
Automated defect classification software with deep learning, real defect modeling and seamless integration with Onto AOI tools.
Inspection Tool Productivity Software
Software solutions to increase the value of your inspection tool.
Enabling In-Line Process Control for Hybrid Bonding Applications
Addressing The Challenges of Metrology for Advanced Packaging
How AI is Helping Optimize AI Chip Production
The Age of Hybrid Bonding: Where We Are and Where We’re Going
Center Stage: The time for hybrid bonding has arrived
Addressing The ABF Substrate Shortage With In-Line Monitoring
In The Spotlight: What Is Responsible For The Surging Demand For CIS?
Understanding Optical Inspection For CIS
Do you have a Dragonfly G3 system question? Let’s talk!
As your partner for innovative solutions, we’re always here for you.
Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
Let’s Talk
"*" indicates required fields