4D InSpec® Surface Gauge
Enhancing quality with this handheld, precision optical instrument for fast, non-contact, 3D measurement of surface features and defects.
Autonomous Systems
Autonomous systems are reshaping industries through AI, sensor fusion and smart interfaces. Discover how Onto Innovation helps ensure quality and reliability in the semiconductors driving this intelligent transformation.
Autonomous Driving
Autonomous driving is transforming mobility by integrating AI, sensor fusion, and real-time decision-making into vehicles. This trend demands ultra-reliable semiconductor components, including CMOS image sensors, MEMS (gyroscopes, accelerometers, pressure sensors, compasses), RF, and power/analog devices. These components must meet stringent safety and performance standards, making inspection and process control critical.
Onto Innovation supports this evolution by providing advanced inspection solutions for CMOS image sensors and key MEMS and analog devices. Our technologies help drive toward the zero-defect goal and help ensure performance consistency, enabling safer, smarter autonomous vehicles.
Human-Machine Interface (HMI)
HMI technologies are redefining how humans interact with machines—through voice, gesture, touch, and even emotion recognition. These interfaces rely on high-performance analog devices, MEMS, and compound semiconductors to deliver intuitive, real-time responsiveness. The challenge lies in ensuring precision and reliability across diverse environmental conditions.
Onto Innovation plays a vital role by delivering process control solutions tailored for compound semiconductor wafers and specialty analog and MEMS devices. Our tools help manufacturers maintain tight tolerances and high yields, enabling seamless, reliable HMI experiences across industries.
Robotics
Robotics is advancing rapidly across industrial, medical and consumer sectors, driven by the growing demand for intelligent automation. As an end-demand application, robotics is accelerating the adoption of AI technologies—enabling machines to perceive, learn and adapt in real time. These systems integrate advanced AI technologies with existing technologies like compound semiconductors, analog devices and MEMS to deliver precision, responsiveness and efficiency required for autonomous operation. However, the complexity of AI-enabled components introduces challenges in inspection and metrology.
Onto Innovation addresses this by providing advanced inspection and metrology solutions tailored for AI chip development and the supporting ecosystem of compound semiconductors, analog and MEMS devices. Our technologies help ensure the quality and reliability essential for the next generation of intelligent, autonomous robots.
4Di InSpec Automated Measurement System (AMS)
High throughput, high resolution automated surface feature and defect measurement solution.
Aspect® System
Advanced infrared optical critical dimension (IRCD) metrology system for high aspect ratio structures in 3D NAND, 2D & 3D DRAM, CIS and power devices.
Atlas® III+ System
Versatile OCD and thin film metrology for mature and mainstream nodes.
Atlas® V System
High performance OCD and thin film metrology for advanced GAA and memory devices.
AutoShell® Software
Integrate equipment and factory 4.0+ systems quickly and comprehensively
Celero™ PL System
Subsurface defect and crystalline defect inspection and classification in bulk and epitaxial III-V materials for application in power semiconductors.
ControlWORKS® Software
The SEMI compliant foundation for process equipment operation and material movement.
Discover® Defect Software
Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
Discover® FDC Software
Your tool’s stepping stone to maximize efficiency, minimize downtime and ensure quality results.
Discover® Patterns Software
Revealing signals hidden in everyday noise.
Discover® Run-to-Run Software
Automating process control with precision and efficiency
Dragonfly® G3 System
Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
Echo™ System
Opto-acoustic film metrology for in-line, non-contact, non-destructive single and multi-layer metal film thickness measurements and material characterization on 150, 200, and 300mm substrates.
Element™ G2 System
Transmission and reflection combined FTIR measurement for advanced epi thickness, film composition control and advanced IR modeling.
Element™ S System
Transmission and reflection combined FTIR Measurement for wafer, specialty devices, supporting 100-200mm wafer sizes.
Iris™ S System
All-in-one solution for film metrology, OCD and stress measurements, tailored for advanced packaging and specialty segments.
IVS 280 System
Overlay, CD and height metrology for 100mm-200mm wafers in the compound semiconductor, power devices, RF, MEMS and LED markets.
IVS 380 System
Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.
NovusEdge® G2 System
Unpatterned edge, notch and backside inspection.
NSX® 330 System
2D automated defect inspection and sample 3D inspection for advanced packaging.
OCD Solutions
A suite of OCD modeling software and computing hardware offering comprehensive capabilities for inline metrology, offline recipe creation and fleet management.
PrimaScan™ System
All-surface defect and contamination inspection for unpatterned wafer and blanket films, with imaging capability for opaque, transparent and semi-transparent wafers, reticles and piece parts.
StepFAST® Software
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
Getting The Biggest ROI On Your Digital Twin
Achieving Zero Defect Manufacturing Part 3: Prevention Of Defects
Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources
Achieving Zero Defect Manufacturing Part 1: Detect & Classify
Using Automatic Defect Classification to Reduce the Escape Rate of Defects
Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections
The Human Hand: Curating Good Data and Creating an Effective Deep-Learning R2R Strategy for High-Volume Manufacturing
Nip the Defect in the Bud: Using an external inspection system and FDC software increases ABF substrate yield
Fab Fingerprint for Proactive Yield Management
The Big Squeeze – Why OSATs Need to Work Smarter
Do you have an autonomous system question? Let’s talk!
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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
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