Yield Optimizer software is the next incarnation of analytics on the evolutionary scale. The software’s disruptive technology analyzes relationships between multivariant data and their complex interactions. By examining any set of conceivable inputs and outputs, Yield Optimizer software identifies the relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

Yield Optimizer software evaluates multiple models and suggests the best one for the data. Using machine learning, it examines the interactions between in-process metrology readings and end-of-line test results for any semiconductor product family and recommends changes to the in-process metrology targets. When licensed as a service, it enables users to leverage an on-demand infrastructure to apply easily understood workflows for complex analytics without the overhead.

Discover Defect software readily integrates into any wafer or panel production environment. It flexibly brings together all pertinent fab information, including defect, sort, metrology, wip, and electrical, into a single big data-capable solution. Its speed and up-time are world class.

Discover Defect software will pay for itself repeatedly by enabling its users to identify and solve problems, as well as to monitor and alarm on known areas of concern quickly and accurately. The product is designed to improve both throughput and yield while simultaneously reducing manufacturing costs.

Expand your yield analysis capabilities with the power of the Discover Yield software module. Discover Yield software’s patented data mining capabilities and advanced statistical analysis allow for highly sophisticated, interactive root cause analysis. Discover Yield software gives you the power to deep-dive into your data to uncover even the most difficult-to-identify systemic process issues.

Discover Yield software helps reduce the time it takes to find root causes of yield excursions and enables manufacturers to broaden their analysis scope for better yield management.

The software includes data acquisition and integration, a development environment through workflow and scripting, and specialized analysis algorithms to identify domain-specific issues, such as data mining, spatial anomalies, wafer processing sequence problems, commonality of effects, system and random yield loss, chamber matching, tool events, traceability and more. In addition, Discover Yield software provides distinct tools – principal components and multivariate analysis of variance (MANOVA) – that allow systematic, simultaneous examination of multiple variables. Discover Yield software’s database architecture for genealogy uniquely supports value chain predictive analytics.

Improving baseline yield with analytics

StepFAST® software is Onto Innovation’s advanced lithography software solution tailored for fan-out panel-level packaging, where die placement errors and material instability can significantly impact yield and productivity. StepFAST® software uses a feed-forward adaptive shot approach, integrating high-speed die placement measurements from the Firefly® system and applying real-time corrections to every shot of the JetStep® lithography tool. This external measurement strategy doubles throughput compared to traditional on-tool (self-metrology) methods. The software also incorporates predictive yield analysis, enabling dynamic adjustment of exposure field sizes to balance throughput and overlay accuracy. By automating reticle selection and optimizing field coverage, StepFAST® software ensures efficient panel exposure while minimizing registration errors—from ±50µm down to under ±3µm. With advanced analytics, StepFAST® software transforms lithography into a flexible, high-efficiency process, delivering substantial improvements in yield, throughput, and cost of ownership for panel-level packaging applications.

The IVS 280 system has been designed for ultimate precision, tool induced shift (TIS) and throughput for 100mm to 200mm wafers, with a mean time between failure (MTBF) > 2,000 hours. The IVS 280 system provides the same capability in a system designed for overhead track handling with full capability per SEMI® standards.

Flexibility is key in compound semiconductor processes, accommodating various wafer sizes, thicknesses, and compositions, including versatile wafer handling for Si, SiC, quartz, glass, GaAs, GaN, and LiNO3 wafers.

Its robust wafer handling and navigation system requires no operator assistance during recipe execution. The IVS 280 system enables wafer size changes without hardware alterations. Recipes and data remain stable over time. The system also supports recipe transfers from older IVS platforms like the IVS 200 and IVS 220.

The demonstrated capabilities of the IVS system to perform with high precision and solid reliability set this system apart.

The Iris S system delivers films metrology and advanced OCD capabilities for the specialty and advanced packaging segments. With a small footprint, it handles 150mm, 200mm, and 300mm wafer sizes, including thin, thick and bonded wafers. The system supports various materials such as Si, SiC, GaN and glass, addressing device-level challenges impacting performance and yield. Leveraging Onto’s Ai Diffract^™ software, the Iris S system supports the most difficult on-wafer high value problems.

The Iris S system includes a dual-arm robot, high-precision stage, advanced pattern recognition, and high-speed focus for accurate positioning at high throughput. The dual channel optical architecture offers oblique incidence Mueller Matrix spectroscopic ellipsometry (MMSE) and normal incidence spectroscopic reflectometry (SR) in a broad wavelength range from UV to IR.

Based on Windows 10 OS and a 64-bit architecture, the Ai Diffract™ software interface and automation comply with SEMI standards. Onto’s model guided machine learning enables fast, flexible and robust film and OCD recipe setup.