The Echo system is a comprehensive in-line metal film metrology tool designed for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging and specialty semiconductor devices. Its innovative optics design extends the dynamic range for film thickness measurement from 50Å to 35µm on a single platform and offers extendibility to measure high aspect ratio advanced 3D NAND structures. The Expert Applications System (EASy™) software provides flexibility for developing user-defined algorithms to model complex multi-layer stacks.

The Echo system’s capabilities have been extended to include materials characterization. In addition to measuring the Young’s Modulus of low-k dielectric films in BEOL and amorphous carbon hard masks in 3D NAND, the Echo system includes proprietary electronics and algorithms for implant monitoring and thermal conductivity characterization. Its small spot size, combined with rapid measurements, enables full wafer mapping capabilities with 0.5mm edge exclusion, improving time to yield.

The Atlas III+ system is a widely adopted inline OCD metrology system, known for its robust and reliable solutions across all OCD and film layers from FEOL to BEOL. With its information-rich optical architecture, powerful OCD and machine learning analysis engine, the Atlas III+ system excels in advanced logic, 3D NAND and DRAM device processes. Extending metrology performance to sub-angstrom precision and accuracy levels, this system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas III+ system incorporates a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s Ai Diffract™ OCD analysis software, it enables process control of every critical manufacturing unit operation. Users can gain insights into complex structure profiles across etch, clean, deposition and CMP steps.

The Atlas V system combines state of the art optical design with an innovative Ai Diffract^™ modeling engine, providing OCD and thin film metrology solutions for measuring complex 3D device structures. The dual channel optical architecture consists of a DUV 4×4 Mueller Matrix (MM) SE and a DUV polarized normal incident reflectometer (NIOCD). Together, they provide rich information for OCD analysis at high precision and high throughput. The Atlas V system is designed to measure the most critical and challenging process steps that include buried features, not visible by CD-SEM and other techniques.

With unique capabilities, such as measuring individual nanowire dimension in a GAA logic device, the Atlas V system is an enabling technology for leading edge device process control.

As the semiconductor industry relentlessly pursues density and power scaling, more and more high aspect ratio (HAR) processes are used across multiple device segments, especially in advanced memory such as 3D NAND and 3D DRAM. The Aspect metrology system was designed with these ongoing architectures and scaling strategies in mind. Aspect metrology has demonstrated superior performance across multiple customer devices through a unique proprietary IRCD system that provides full profiling capability to enable critical process control, with the speed and process coverage that customers require.

The Aspect system is powered by a software analysis engine, Ai Diffract™, that provides up to 90% faster time to solution which extends the industry leading NanoDiffract^® software by leveraging extensive machine learning capabilities along with high fidelity modeling. The result is a simultaneous improvement in metrology performance along with a significant time to solution reduction.

The 4Di InSpec Automated Measurement System is a non-contact optical surface gauge, either the 4D InSpec or 4D InSpec XL, integrated with a choice of collaborative robots, an optional rotary table and a safety cell for rapid production inspection.

This fully automated 3D optical system can measure dozens of edge break features, chamfers, and radii in minutes, vastly improving throughput and driving down inspection costs.

Designed as a turnkey cell for quality control, it is ideal for precision machined components such as turbine blades and rotors, air foils, high pressure compressor blades, blisks and dovetails. The high resolution system can measure in any orientation, on curved surfaces, over large and complex geometries, and in tight spaces or blind locations.

The 4Di InSpec AMS accurately captures complex feature dimensions, enabling more precise part disposition. Its rapid measurement capabilities reduce inspection queuing times, while the ability to measure at multiple locations in the same timeframe ensures part quality.

The 4Di InSpec optical surface gauge is the first handheld precision instrument designed for non-contact surface defect measurement. With micrometer-level resolution, portability, affordability and ease-of-use, the 4Di InSpec surface gauge brings high resolution 3D surface measurement where it’s needed: on the factory floor, in machine shops, and in field service applications.

This surface gauge provides 3D surface measurements to instantly quantify defects and features up to 100 mils (2,540 micrometers) deep. Without the need for replication, it can measure large components of varying complex geometries directly. It is adaptable for handheld use, workstation setups, or robotic operation with optional accessories to meet specific customer challenges.

Even with its incredible precision and extensive analysis capabilities, its ease of use allows non-experts to take measurements after just minutes of training.