Yield Optimizer software is the next incarnation of analytics on the evolutionary scale. The software’s disruptive technology analyzes relationships between multivariant data and their complex interactions. By examining any set of conceivable inputs and outputs, Yield Optimizer software identifies the relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

Yield Optimizer software evaluates multiple models and suggests the best one for the data. Using machine learning, it examines the interactions between in-process metrology readings and end-of-line test results for any semiconductor product family and recommends changes to the in-process metrology targets. When licensed as a service, it enables users to leverage an on-demand infrastructure to apply easily understood workflows for complex analytics without the overhead.

TrueADC software sets a new standard in defect classification by combining advanced analytics with intuitive usability. Seamlessly integrated with Onto Innovation’s AOI tools and Discover platforms, TrueADC software enhances inspection value through a proprietary hybrid decision-making process across all wafers and surfaces.

With over 70% reduction in manual review, TrueADC software intelligently flags low-confidence defects as “unknown” to avoid misclassification. Its dynamic defect library method uses real defect examples—unlike traditional ADCs that rely on approximations—delivering more accurate and efficient results.

Supporting adder, repeater, SPR codes, and region-of-interest data, it enables precise tool sampling and binning. Operators can quickly classify new defects without altering recipes, while the software’s multi-engine mode leverages deep learning to reduce overkill and underkill.

From model development to identifying hard-to-isolate defects, TrueADC software empowers engineers with greater clarity, control, and confidence.

Discover Patterns software combines sort and defect spatial patterns utilizing proprietary machine learning (ML) algorithms, to uncover hidden patterns that would have been otherwise lost. Segmentation allows users to eliminate noise and extract definitive patterns from a larger pattern or a seemingly random array of defects. Wafer stacking enables the handling of faint defect trends to more clearly isolate patterns.

Combining Discover Patterns software with the Discover Defect platform multiplies the value of your defect management infrastructure by intelligently identifying and acting upon known patterns in real time. It marks defects and die affected by patterns for deeper understanding of processes and reduces the need for human intervention.

Highlight all patterns, not just the dominant ones

Discover Yield software helps reduce the time it takes to find root causes of yield excursions and enables manufacturers to broaden their analysis scope for better yield management.

The software includes data acquisition and integration, a development environment through workflow and scripting, and specialized analysis algorithms to identify domain-specific issues, such as data mining, spatial anomalies, wafer processing sequence problems, commonality of effects, system and random yield loss, chamber matching, tool events, traceability and more. In addition, Discover Yield software provides distinct tools – principal components and multivariate analysis of variance (MANOVA) – that allow systematic, simultaneous examination of multiple variables. Discover Yield software’s database architecture for genealogy uniquely supports value chain predictive analytics.

Improving baseline yield with analytics

StepFAST® software is Onto Innovation’s advanced lithography software solution tailored for fan-out panel-level packaging, where die placement errors and material instability can significantly impact yield and productivity. StepFAST® software uses a feed-forward adaptive shot approach, integrating high-speed die placement measurements from the Firefly® system and applying real-time corrections to every shot of the JetStep® lithography tool. This external measurement strategy doubles throughput compared to traditional on-tool (self-metrology) methods. The software also incorporates predictive yield analysis, enabling dynamic adjustment of exposure field sizes to balance throughput and overlay accuracy. By automating reticle selection and optimizing field coverage, StepFAST® software ensures efficient panel exposure while minimizing registration errors—from ±50µm down to under ±3µm. With advanced analytics, StepFAST® software transforms lithography into a flexible, high-efficiency process, delivering substantial improvements in yield, throughput, and cost of ownership for panel-level packaging applications.