Aspect® System
Advanced infrared optical critical dimension (IRCD) metrology system for high aspect ratio structures in 3D NAND, 2D & 3D DRAM, CIS and power devices.
Sustainability
Sustainability in semiconductors drives progress in green energy and electric vehicles. Onto Innovation supports this shift with advanced metrology and process control for compound and power semiconductor manufacturing.
Green Energy
As the world shifts toward renewable energy sources, the demand for efficient power conversion and management is surging. This transition hinges on compound semiconductors like silicon carbide (SiC) and gallium nitride (GaN), which are essential for high-voltage, high-efficiency applications such as solar inverters and wind turbines. However, these materials present unique challenges in manufacturing, including defect detection and process variability.
Onto Innovation addresses these challenges through advanced metrology and inspection solutions tailored for the specialty semiconductor market. Our tools enable precise characterization of compound semiconductor wafers, ensuring quality and reliability in power devices. By enhancing yield and reducing waste, Onto Innovation plays a critical role in making green energy technologies more scalable and sustainable.
Electric Vehicles
Electric vehicles (EVs) are transforming transportation, but their performance and efficiency depend heavily on power semiconductors that manage energy flow between the battery and motor. These devices must operate reliably under high voltages and temperatures, making process control a critical factor in their production.
Onto Innovation supports this evolution with cutting-edge process control solutions that optimize the fabrication of power semiconductor devices. Our technologies help manufacturers detect defects early, monitor critical parameters, and maintain tight process windows—helping to ensure the high performance and safety standards EVs demand. By enabling more efficient and reliable power electronics, Onto Innovation is helping accelerate the global shift to electric mobility.
Atlas® III+ System
Versatile OCD and thin film metrology for mature and mainstream nodes.
Celero™ PL System
Subsurface defect and crystalline defect inspection and classification in bulk and epitaxial III-V materials for application in power semiconductors.
Discover® Defect Software
Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
Discover® Yield Software
An advanced yield analysis toolkit that seamlessly integrates data from your entire enterprise, helping to prevent loss and better understand your process needs.
Dragonfly® G3 System
Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
EB40™ Module
Edge and backside inspection.
Echo™ System
Opto-acoustic film metrology for in-line, non-contact, non-destructive single and multi-layer metal film thickness measurements and material characterization on 150, 200, and 300mm substrates.
Element™ S System
Transmission and reflection combined FTIR Measurement for wafer, specialty devices, supporting 100-200mm wafer sizes.
F30™ System
Advanced macro inspection for front-end manufacturers.
Iris™ S System
All-in-one solution for film metrology, OCD and stress measurements, tailored for advanced packaging and specialty segments.
IVS 280 System
Overlay, CD and height metrology for 100mm-200mm wafers in the compound semiconductor, power devices, RF, MEMS and LED markets.
NSX® 330 System
2D automated defect inspection and sample 3D inspection for advanced packaging.
StepFAST® Software
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
Yield Optimizer™ Software
Machine learning built with semiconductor manufacturing in mind.
Using Picosecond Ultrasonics To Measure Trench Structures In SiC Power Devices
Using OCD To Measure Trench Structures in SiC Power Devices
Using FTIR To Improve SiC Power Device Performance
Addressing Trench Structures and Larger Wafers for Power Devices
The Road to SiC Process Control
Optimizing Metal Film Measurement on IGBT And MOSFET Power Devices with Picosecond Ultrasonic Technology
Using Advanced Analytics To Meet ESG Goals
Do you have a sustainability question? Let’s talk!
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