Aspect® System
Advanced infrared optical critical dimension (IRCD) metrology system for high aspect ratio structures in 3D NAND, 2D & 3D DRAM, CIS and power devices.
Connectivity
Connectivity is reshaping mobility and IoT. From 3D NAND to RF devices, Onto Innovation delivers advanced metrology and inspection solutions that enable high-performance, energy-efficient semiconductors for a seamlessly connected world.
Mobility
The future of mobility is defined by smarter, more connected, higher data throughput, vehicles and portable devices that demand high-performance, energy-efficient semiconductors. These applications rely heavily on advanced memory technologies like 3D NAND, which enable faster data access and greater storage density. However, manufacturing these complex structures introduces challenges in defect detection and layer uniformity.
Onto Innovation addresses these hurdles with advanced inspection and metrology solutions tailored for 3D NAND and compound semiconductor wafers. Our tools help ensure precise process control, enabling manufacturers to meet the rigorous demands of mobile applications. In the specialty device market, our solutions also support power management components like MOSFETs and MEMS, which are critical for battery efficiency and system reliability in mobile environments.
Internet of Things (IoT)
IoT is transforming industries by embedding intelligence into everyday objects—from smart homes to industrial automation. This explosion of connected devices requires ultra-low-power semiconductors, robust DRAM for real-time data processing, and reliable power management solutions.
Onto Innovation plays a pivotal role in enabling IoT by providing metrology and inspection solutions for DRAM and compound semiconductors used in power devices. Our tools support the production of high-yield, high-reliability components such as MOSFETs and MEMS, which are essential for IoT device efficiency and longevity. As the IoT ecosystem expands, Onto’s solutions help manufacturers scale production while maintaining the precision and reliability these applications demand.
5G/6G Communications
Wireless networks like 5G and emerging 6G technologies are revolutionizing how data is transmitted, demanding ultra-fast, low-latency communication. These systems rely on advanced RF components often based on unique materials or processes combined with compound semiconductors that must meet stringent performance and reliability standards.
Onto Innovation supports this evolution with cutting-edge metrology solutions that ensure the integrity of RF devices and materials. Our tools are critical for monitoring process variation and ensuring long-term reliability in high-frequency applications. By enabling precise control over complex semiconductor structures, Onto helps manufacturers deliver the performance and durability required for the connected world of today.
Atlas® III+ System
Versatile OCD and thin film metrology for mature and mainstream nodes.
Atlas® V System
High performance OCD and thin film metrology for advanced GAA and memory devices.
Discover® AI Software
A cutting-edge AI engine built for semiconductor manufacturing, providing actionable predictions and insights across nearly any process area.
Discover® Defect Software
Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
Discover® Yield Software
An advanced yield analysis toolkit that seamlessly integrates data from your entire enterprise, helping to prevent loss and better understand your process needs.
Dragonfly® G3 System
Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
EB40™ Module
Edge and backside inspection.
Echo™ System
Opto-acoustic film metrology for in-line, non-contact, non-destructive single and multi-layer metal film thickness measurements and material characterization on 150, 200, and 300mm substrates.
Element™ G2 System
Transmission and reflection combined FTIR measurement for advanced epi thickness, film composition control and advanced IR modeling.
Element™ S System
Transmission and reflection combined FTIR Measurement for wafer, specialty devices, supporting 100-200mm wafer sizes.
IMPULSE® V System
Advanced high throughput integrated metrology system with AI-driven machine learning option. The system offers maximum sensitivity and accuracy to CMP process excursions and enables process engineers to establish APC control with high-accuracy feedback.
IMPULSE®+ System
Integrated metrology system offering maximum sensitivity and accuracy to CMP process excursions and enabling process engineers to establish APC control with high-accuracy feedback.
Iris™ G2 System
A high throughput common and critical thin film optical system for advanced and mature node devices.
Iris™ S System
All-in-one solution for film metrology, OCD and stress measurements, tailored for advanced packaging and specialty segments.
IVS 280 System
Overlay, CD and height metrology for 100mm-200mm wafers in the compound semiconductor, power devices, RF, MEMS and LED markets.
IVS 380 System
Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.
NovusEdge® G2 System
Unpatterned edge, notch and backside inspection.
NSX® 330 System
2D automated defect inspection and sample 3D inspection for advanced packaging.
OCD Solutions
A suite of OCD modeling software and computing hardware offering comprehensive capabilities for inline metrology, offline recipe creation and fleet management.
PrecisionWoRx® VX4 System
Wafer probe card test and analysis system.
PrimaScan™ System
All-surface defect and contamination inspection for unpatterned wafer and blanket films, with imaging capability for opaque, transparent and semi-transparent wafers, reticles and piece parts.
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Do you have a connectivity question? Let’s talk!
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