Advanced Optical Critical Dimension (OCD) and Film metrology products to help ensure accuracy and repeatability for semiconductor manufacturers worldwide.
Dedicated to panel-level packaging (PLP) innovations enabling 2.5D, FOPLP, 3D chiplet architectures, and AI packages for both glass and organic substrates (CCL)
Uniquely tailored hardware and software solutions solving operational or technical problems enabling value beyond the substrate for customers
Spotlight
Smaller Geometries, Bigger Demands: The Role of OCD in GAA Logic and Vertical Gate DRAM Process Control
AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development.
