Yield Optimizer™ Software

Yield Optimizer software is part of a comprehensive next-level data management portfolio. It reimagines manufacturing line control and analytics to explore the impact of previously invisible factors in day-to-day factory operation.

Product Overview

Yield Optimizer software is the next incarnation of analytics on the evolutionary scale. The software’s disruptive technology analyzes relationships between multivariant data and their complex interactions. By examining any set of conceivable inputs and outputs, Yield Optimizer software identifies the relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

Yield Optimizer software evaluates multiple models and suggests the best one for the data. Using machine learning, it examines the interactions between in-process metrology readings and end-of-line test results for any semiconductor product family and recommends changes to the in-process metrology targets. When licensed as a service, it enables users to leverage an on-demand infrastructure to apply easily understood workflows for complex analytics without the overhead.

Applications

  • Yield Prediction
  • Process Targeting
  • Design of Experiment (DOE) Assistant
  • Troubleshooting

 

Neural networks model today’s data to achieve tomorrow’s in-line targets

 

Users across the fab benefit from Yield Optimizer software’s easy-to-apply analytics

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TrueADC® Software

TrueADC software enhances defect classification accuracy and efficiency by combining deep learning, real-world defect modeling, and intuitive workflows—reducing manual review and improving decision-making across all wafers and surfaces.

Product Overview

TrueADC software sets a new standard in defect classification by combining advanced analytics with intuitive usability. Seamlessly integrated with Onto Innovation’s AOI tools and Discover platforms, TrueADC software enhances inspection value through a proprietary hybrid decision-making process across all wafers and surfaces.

With over 70% reduction in manual review, TrueADC software intelligently flags low-confidence defects as “unknown” to avoid misclassification. Its dynamic defect library method uses real defect examples—unlike traditional ADCs that rely on approximations—delivering more accurate and efficient results.

Supporting adder, repeater, SPR codes, and region-of-interest data, it enables precise tool sampling and binning. Operators can quickly classify new defects without altering recipes, while the software’s multi-engine mode leverages deep learning to reduce overkill and underkill.

From model development to identifying hard-to-isolate defects, TrueADC software empowers engineers with greater clarity, control, and confidence.

Applications

  • On-tool with Onto AOI systems
  • Inline defect classification
  • Dynamic defect library utilization
  • Support for advanced defect types
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Discover® Patterns Software

Discover Patterns software quickly and easily traces patterns back to yield-killing process issues.

Product Overview

Discover Patterns software combines sort and defect spatial patterns utilizing proprietary machine learning (ML) algorithms, to uncover hidden patterns that would have been otherwise lost. Segmentation allows users to eliminate noise and extract definitive patterns from a larger pattern or a seemingly random array of defects. Wafer stacking enables the handling of faint defect trends to more clearly isolate patterns.

Combining Discover Patterns software with the Discover Defect platform multiplies the value of your defect management infrastructure by intelligently identifying and acting upon known patterns in real time. It marks defects and die affected by patterns for deeper understanding of processes and reduces the need for human intervention.

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Highlight all patterns, not just the dominant ones

Applications

  • Memory
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  • Foundry
  • Compound-Semi
  • LED
  • Advanced Packaging
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Discover® Run-to-Run Software

Discover Run-to-Run software boosts profits and productivity with swift deployment on any process or tool, increasing Cpk and throughput while reducing pilot wafers, engineering time and manufacturing costs.

Product Overview

Discover Run-to-Run software is a feature-rich application that enables advanced supervisory process control, surpassing traditional statistical methods. It ensures precise process goals. For example, achieving desired thickness is possible through tailored adjustments of machine parameters like deposition duration or pressure settings. Designed for high-mix production, it allows seamless transfer of control strategies across factories for operational flexibility. Proven globally, it operates thousands of tools across hundreds of processes continuously. With its adaptable, framework-based APC solution, Discover Run-to-Run software enables rapid factory-wide deployment, delivering significant and immediate return on investment while enhancing consistency, productivity and efficiency.

Discover® Run-to-Run Software

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  • ASIC
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  • HDD
  • Advanced Packaging
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Discover® Yield Software

Discover Yield software is a complete yield management enterprise platform that combines parametric, defect and yield optimization with data mining and workflow development across all data sources from memory and design to assembly and packaging.

Product Overview

Discover Yield software helps reduce the time it takes to find root causes of yield excursions and enables manufacturers to broaden their analysis scope for better yield management.

The software includes data acquisition and integration, a development environment through workflow and scripting, and specialized analysis algorithms to identify domain-specific issues, such as data mining, spatial anomalies, wafer processing sequence problems, commonality of effects, system and random yield loss, chamber matching, tool events, traceability and more. In addition, Discover Yield software provides distinct tools – principal components and multivariate analysis of variance (MANOVA) – that allow systematic, simultaneous examination of multiple variables. Discover Yield software’s database architecture for genealogy uniquely supports value chain predictive analytics.

 

Discover® Yield Software

Improving baseline yield with analytics

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  • End-to-end root cause finding for semiconductor manufacturing
  • Integrate with Discover AI for process & yield prediction
  • Genealogy capability ties context information from bare wafer to integrated package
  • Enable rapid equipment studies and equipment matching
  • Integrate with Reports service to automate repeat reports for traceability
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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.

Let’s Talk

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This field is for validation purposes and should be left unchanged.

Discover® AI Software

Discover AI software leverages high-quality data input to provide valuable insights into processes and actionable predictions for process, yield and efficiency improvements through integration with the Discover data platform.

Product Overview

Discover AI software is a disruptive technology that reshapes the way we approach manufacturing line control and yield analysis. It leverages the latest in machine learning and artificial intelligence to identify actionable improvements and connections in data that a human could not. The software’s optimization engine adds a powerful machine learning analytical method to an already sophisticated toolbox of process improvement applications.

By analyzing any set of conceivable inputs and outputs, Discover AI software identifies relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

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  • Yield Optimization
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  • Process prediction & tuning
  • Embedded AI – process digital twin
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"*" indicates required fields

This field is for validation purposes and should be left unchanged.