Discover® FDC Software

Discover FDC software is part of a robust data management suite, serving as the ideal gateway to digital transformation and unlocking Industry 4.0 best practices for impactful results.

Product Overview

Discover FDC software transforms tool sensor data into actionable insights. It empowers manufacturers to optimize fab efficiency, scaling seamlessly to high-volume manufacturing while reducing tool downtime by detecting anomalies early. With its diverse set of flexible controls and real-time data analysis, Discover FDC software enhances productivity, improves cycle time and increases equipment availability (OEE). Its user-friendly interface integrates advanced process control, allowing engineers to pinpoint issues and bring equipment online faster. Proven across processes and operational modules, it eliminates wasted time and energy by preventing idle tools and minimizing scrapped wafers. When connected to Discover Defect and Discover Yield software, Discover FDC software identifies meaningful correlations that drive even greater efficiency and production results. This robust solution redefines control, setting a new standard for achieving maximum enterprise-wide factory performance. That’s control, redefined.

 

Discover® FDC Software

Applications

  • Memory
  • Logic
  • ASIC
  • Compound-Semi
  • HDD
  • Advanced Packaging
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Discover® Defect Software

Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
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Discover® Run-to-Run Software

Automating process control with precision and efficiency
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Discover® Run-to-Run Software

Discover Run-to-Run software boosts profits and productivity with swift deployment on any process or tool, increasing Cpk and throughput while reducing pilot wafers, engineering time and manufacturing costs.

Product Overview

Discover Run-to-Run software is a feature-rich application that enables advanced supervisory process control, surpassing traditional statistical methods. It ensures precise process goals. For example, achieving desired thickness is possible through tailored adjustments of machine parameters like deposition duration or pressure settings. Designed for high-mix production, it allows seamless transfer of control strategies across factories for operational flexibility. Proven globally, it operates thousands of tools across hundreds of processes continuously. With its adaptable, framework-based APC solution, Discover Run-to-Run software enables rapid factory-wide deployment, delivering significant and immediate return on investment while enhancing consistency, productivity and efficiency.

Discover® Run-to-Run Software

Applications

  • Memory
  • Logic
  • ASIC
  • Compound Semi
  • HDD
  • Advanced Packaging
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Discover® FDC Software

Your tool’s stepping stone to maximize efficiency, minimize downtime and ensure quality results.
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AutoShell® Software

Integrate equipment and factory 4.0+ systems quickly and comprehensively
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Discover® Yield Software

Discover Yield software is a complete yield management enterprise platform that combines parametric, defect and yield optimization with data mining and workflow development across all data sources from memory and design to assembly and packaging.

Product Overview

Discover Yield software helps reduce the time it takes to find root causes of yield excursions and enables manufacturers to broaden their analysis scope for better yield management.

The software includes data acquisition and integration, a development environment through workflow and scripting, and specialized analysis algorithms to identify domain-specific issues, such as data mining, spatial anomalies, wafer processing sequence problems, commonality of effects, system and random yield loss, chamber matching, tool events, traceability and more. In addition, Discover Yield software provides distinct tools – principal components and multivariate analysis of variance (MANOVA) – that allow systematic, simultaneous examination of multiple variables. Discover Yield software’s database architecture for genealogy uniquely supports value chain predictive analytics.

 

Discover® Yield Software

Improving baseline yield with analytics

Applications

  • End-to-end root cause finding for semiconductor manufacturing
  • Integrate with Discover AI for process & yield prediction
  • Genealogy capability ties context information from bare wafer to integrated package
  • Enable rapid equipment studies and equipment matching
  • Integrate with Reports service to automate repeat reports for traceability
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Discover® Defect Software

Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
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Discover® FDC Software

Your tool’s stepping stone to maximize efficiency, minimize downtime and ensure quality results.
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Yield Optimizer™ Software

Machine learning built with semiconductor manufacturing in mind.
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StepFAST® Software

An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.

Product Overview

StepFAST® software is Onto Innovation’s advanced lithography software solution tailored for fan-out panel-level packaging, where die placement errors and material instability can significantly impact yield and productivity. StepFAST® software uses a feed-forward adaptive shot approach, integrating high-speed die placement measurements from the Firefly® system and applying real-time corrections to every shot of the JetStep® lithography tool. This external measurement strategy doubles throughput compared to traditional on-tool (self-metrology) methods. The software also incorporates predictive yield analysis, enabling dynamic adjustment of exposure field sizes to balance throughput and overlay accuracy. By automating reticle selection and optimizing field coverage, StepFAST® software ensures efficient panel exposure while minimizing registration errors—from ±50µm down to under ±3µm. With advanced analytics, StepFAST® software transforms lithography into a flexible, high-efficiency process, delivering substantial improvements in yield, throughput, and cost of ownership for panel-level packaging applications.

Applications

  • Panel-level packaging

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Sub-micron automatic defect inspection with integrated 3D metrology for advanced IC substrates and panel level packaging.
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JetStep® X500 System

Designed for advanced integrated circuit substrates (AICS) and other advanced packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm L/S resolution with a large depth of focus.
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JetStep® S3500 System

Advanced packaging lithography system designed for fan-out panel level packaging, accommodating substrates up to 720mm x 600mm
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Do you have a StepFAST software question? Let’s talk!

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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.

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Discover® AI Software

Discover AI software leverages high-quality data input to provide valuable insights into processes and actionable predictions for process, yield and efficiency improvements through integration with the Discover data platform.

Product Overview

Discover AI software is a disruptive technology that reshapes the way we approach manufacturing line control and yield analysis. It leverages the latest in machine learning and artificial intelligence to identify actionable improvements and connections in data that a human could not. The software’s optimization engine adds a powerful machine learning analytical method to an already sophisticated toolbox of process improvement applications.

By analyzing any set of conceivable inputs and outputs, Discover AI software identifies relationships and interactions that lead to positive operational changes. Easily understood visuals empower even casual users to understand what is important before making adjustments.

Discover AI software evaluates multiple models and suggests the optimal one for the data. Using machine learning, it examines interactions between in-process inputs and results for any semiconductor product family and recommends changes to in-process targets. Licensed as a service, it enables users to leverage an on-demand infrastructure to apply easily understood workflows for complex analytics without the overhead.

Applications

  • Yield Optimization
  • Virtual Metrology
  • Process prediction & tuning
  • Embedded AI – process digital twin
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As your partner for innovative solutions, we’re always here for you.

Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.

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