Discover® RMS Software
Discover RMS software is a complete solution for recipe management. This unified repository automatically delivers the right recipe to the right system at the right time.
Product Overview
Discover RMS software is a factory-level recipe management system that provides a central server repository for all recipes. This system allows desktop access for editing and includes complete version control of all recipes used within the fab.
When coupled with Discover Run-to-Run software, it fundamentally tracks all control changes by automatically inserting recipe values into the recipe body. Working in concert with your MES system, recipes are automatically selected and downloaded to the right tool to be executed on the right material. The recipe sign-off feature enforces a tight control of recipes by ensuring customer approval of any large changes.

The Discover RMS Process
Applications
- Memory
- Logic
- ASIC
- Compound Semi
- HDD
- Advanced Packaging
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Discover® FDC Software
Discover FDC software is part of a robust data management suite, serving as the ideal gateway to digital transformation and unlocking Industry 4.0 best practices for impactful results.
Product Overview
Discover FDC software transforms tool sensor data into actionable insights. It empowers manufacturers to optimize fab efficiency, scaling seamlessly to high-volume manufacturing while reducing tool downtime by detecting anomalies early. With its diverse set of flexible controls and real-time data analysis, Discover FDC software enhances productivity, improves cycle time and increases equipment availability (OEE). Its user-friendly interface integrates advanced process control, allowing engineers to pinpoint issues and bring equipment online faster. Proven across processes and operational modules, it eliminates wasted time and energy by preventing idle tools and minimizing scrapped wafers. When connected to Discover Defect and Discover Yield software, Discover FDC software identifies meaningful correlations that drive even greater efficiency and production results. This robust solution redefines control, setting a new standard for achieving maximum enterprise-wide factory performance. That’s control, redefined.

Applications
- Memory
- Logic
- ASIC
- Compound-Semi
- HDD
- Advanced Packaging
Do you have a Discover FDC software question? Let’s talk!
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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
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Discover® Run-to-Run Software
Discover Run-to-Run software boosts profits and productivity with swift deployment on any process or tool, increasing Cpk and throughput while reducing pilot wafers, engineering time and manufacturing costs.
Product Overview
Discover Run-to-Run software is a feature-rich application that enables advanced supervisory process control, surpassing traditional statistical methods. It ensures precise process goals. For example, achieving desired thickness is possible through tailored adjustments of machine parameters like deposition duration or pressure settings. Designed for high-mix production, it allows seamless transfer of control strategies across factories for operational flexibility. Proven globally, it operates thousands of tools across hundreds of processes continuously. With its adaptable, framework-based APC solution, Discover Run-to-Run software enables rapid factory-wide deployment, delivering significant and immediate return on investment while enhancing consistency, productivity and efficiency.

Applications
- Memory
- Logic
- ASIC
- Compound Semi
- HDD
- Advanced Packaging
Do you have a Discover Run-to-Run software question? Let’s talk!
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Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
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StepFAST® Software
An advanced feed-forward lithography software solution for fan-out panel level packaging that enhances yield and throughput by correcting die placement errors through external measurements, predictive analytics and adaptive shot control.
Product Overview
StepFAST® software is Onto Innovation’s advanced lithography software solution tailored for fan-out panel-level packaging, where die placement errors and material instability can significantly impact yield and productivity. StepFAST® software uses a feed-forward adaptive shot approach, integrating high-speed die placement measurements from the Firefly® system and applying real-time corrections to every shot of the JetStep® lithography tool. This external measurement strategy doubles throughput compared to traditional on-tool (self-metrology) methods. The software also incorporates predictive yield analysis, enabling dynamic adjustment of exposure field sizes to balance throughput and overlay accuracy. By automating reticle selection and optimizing field coverage, StepFAST® software ensures efficient panel exposure while minimizing registration errors—from ±50µm down to under ±3µm. With advanced analytics, StepFAST® software transforms lithography into a flexible, high-efficiency process, delivering substantial improvements in yield, throughput, and cost of ownership for panel-level packaging applications.
Applications
- Panel-level packaging
Featured Markets
Adaptive Shot Lithography Solution
Die shift on reconstituted panels can significantly impact both productivity and yield. To address this challenge, we use a parallel die placement measurement process and advanced analytics to provide a means to balance productivity against yield. Our integrated lithography cell, featuring Firefly inspection, StepFAST software, and JetStep Lithography, delivers industry-leading throughput and yield for fan-out panel level packaging.
Overcoming FOPLP Die Placement Error
It is well understood that advanced packaging applications require high performance, low cost, increased functionality and improved reliability that 2.5D and 3D packaging solutions provide. Fan-out panel-level packaging (FOPLP) is one of the technologies that has the potential to meet these packaging requirements.
Do you have a StepFAST software question? Let’s talk!
As your partner for innovative solutions, we’re always here for you.
Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.
Let’s Talk
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