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dec 2025 blog
Smaller Geometries, Bigger Demands: The Role of OCD in GAA Logic and Vertical Gate DRAM Process Control

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development.

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Spotlight
dec 2025 blog
Smaller Geometries, Bigger Demands: The Role of OCD in GAA Logic and Vertical Gate DRAM Process Control
Company
Upcoming Events
seoul-korea
SEMICON Korea
Posted on Feb 2, 2024

The Great Lithography Debate: Copper Clad Laminate or Glass Substrates?

from Chip Scale Review
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Onto Innovation’s Doug Brown is pleased to publish, “The Great Lithography Debate: Copper Clad Laminate or Glass Substrates?” in the January-February 2024 issue of the Chip Scale Review.

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