Addressing The Challenges of Metrology for Advanced Packaging
In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.
You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:
- Hybrid bonding
- 3D stacking with micro bumps
- RDL applications for interposers
- TSV applications
The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.