PrimaScan™ P System
The PrimaScan P System provides all-surface defect and contamination inspection with imaging capability for glass panel substrates.
Product Overview
As panel-level-packaging (PLP) transition from copper-clad laminates (CCL) to glass, the industry must adapt to ensure starting substrates are free of killer defects and contamination or latent defects that may result in yield loss or scrapped panels at later stages in the process flow. The PrimaScan P system is specifically designed to address incoming glass panel quality control for both the advanced IC substrate (AICS) and fan-out panel level processing (FOPLP) segments.
The PrimaScan P system delivers unique laser-based scanning and imaging via proprietary optics and sensing technologies for the reliable inspection of nanometer sized defects for either R&D or high-volume manufacturing environments. Utilizing multiple channel inspection technologies, the system can detect, measure and image surface particles, scratches, pits, surface contamination, stains, film or bulk panel stress, voids/inclusions, including chips and cracks at the edge of the panel.
Applications
- Incoming unpatterned glass panel quality inspection
- Blanket photoresist, dielectric or metallic coated panels
- Buried defects and voids in transparent and semi-transparent blanket films
- Across panel stress and induced point stress
Featured Markets
PrimaScan™ System
PrimaScan™ R&D System
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