MBIR System
The MBIR system is a revolutionary in-line, non-destructive infrared reflectometry system that enables critical process control of high aspect ratio structures, films and epitaxial structures. It meets the needs of leading-edge customers with its high speed and process coverage.
Product Overview
As more high aspect ratio processes are used in multiple industry segments, there are metrology needs for monitoring of related processes, including dimensions and properties of carbon film hard masks and etched 3D structures.
The MBIR system delivers high-throughput, low COO, non-contact, non-destructive measurements of dimensions and uniformity of layers and etched structures used in integrated circuit manufacturing. The small spot size makes the tool suitable for measurements of scribe line test structures as in-line process control. The unique technology and analysis capability simplifies system calibration requirements and removes the effect of substrate variations for key layer measurements.
While the software contains advanced features for measurement recipe and analysis model creation, it has a user-friendly interface and implementation that allows the fab customers to create and manage the recipe system for MBIR tool fleets.
Thickness map from amorphous carbon film
Applications
- Carbon hardmask used on V-NAND devices and test wafers
- Deep trench etch for CIS and analog device chips
- Doping monitoring of SiGeB and SiP materials
- Film composition characterization
- On-device and blanket wafer materials characterization for EPI process
Featured Markets
Element™ G2 System
Element™ S System
Aspect® System
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