F30™ System
The F30 system is designed to blur the lines between dark field micro inspection and traditional macro inspection, providing automated defect inspection for front-end and outgoing quality (OQA) applications.
Product Overview
The F30 automated defect inspection system combines high resolution and throughput to drive fab yield and productivity. A five-objective turret enables resolution-throughput flexibility, while its multi-channel illumination including brightfield, darkfield, high-angle ring light, and IR-Review addresses the requirements for today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations. The system can handle 100mm – 300mm wafers can be paired with the edge and backside module (EB40) to provide an all-surface inspection solution.
Applications
- After develop inspection (ADI)
- Post CMP inspection
- After etch inspection
- Fab Outgoing QA
Featured Markets
Discover® Defect Software
EB40™ Module
TrueADC® Software
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