Quick Search
Find a Product:
Product Categories
Worldwide Reach
Find Local Support:
Customer Success
Tech Trends
Corporate Responsiblity
Menu
Products & Technology
Customer Success
Insights & Resources
Company

EB40™ Module

The EB40 Module combines edge and backside inspection into one tool with the option to be paired with an inspection system to provide a high throughput all surface inspection solution.

EB40™ Module

Product Overview

The Class 1 certified EB40 module offers combined edge and backside inspection and is also available as separate edge (E40) and backside (B40) modules. These modules provide brightfield and darkfield inspection to detect defects on the entire bevel and backside, covering Zone 1 to Zone 5. This enables faster root-cause analysis of defects that can migrate to the wafer interior, impacting die yield.

The EB40 module captures defect images on the fly, creates whole-wafer composite images, and integrates with SEM bevel review. All inspection and metrology results, including defect, whole wafer and SEM images can be analyzed together in a single database using Discover Defect software. Correlating EBR metrology with defectivity data, SEM data and micro-inspection results is just the beginning of what Discover software can do. In addition to advanced on-tool defect binning, real-time edge ADC classification can be assigned to defects prior to manual offline review using Discover Review software.

Applications

  • EDGE INSPECTION
  • Lithography process monitoring
  • Cracks/Chips, Slurry, cleaning contaminants and residual films
  • EBR Metrology
  • Bonded wafer adhesive inspection
  • BACKSIDE INSEPCTION
  • Scratches
  • Chuck and end effector signatures
  • Backside particles and residues
  • Wafer level pattern detection
Related Products
View all
dragonfly g3_feat

Dragonfly® G3 System

Automated high speed sub-micron 2D inspection and 3D inspection/metrology for inline process control of pattern defects in next generation technologies for advanced packaging, specialty and OQA.
View Product
f30_feat

F30™ System

Advanced macro inspection for front-end manufacturers.
View Product
nsx330_feat

NSX® 330 System

2D automated defect inspection and sample 3D inspection for advanced packaging.
View Product
discoverdefect_feat

Discover® Defect Software

Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
View Product
discoverreview_feat

Discover® Review Software

Your smart factory’s human classification interface.
View Product
Related Insights & Resources
View all
Default product image

Enabling In-Line Process Control for Hybrid Bonding Applications

Learn more

Do you have an EB40 module question? Let’s talk!

As your partner for innovative solutions, we’re always here for you.

Discover how our cutting-edge semiconductor solutions are engineered to meet your most complex challenges: delivering performance, reliability and innovation where it matters most.

Let’s Talk

"*" indicates required fields