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Challenges In Stacking HBM
Challenges in Stacking HBM

Learn how to reduce stress that causes warpage, how HBM architectures will need to change, and what happens when hybrid bonding and co-packaged optics are added into these devices from Onto Innovation's topical video with Semiconductor Engineering.

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Discover® Review Software

Discover Review software is an intuitive classification solution that rapidly guides users through the sequences of defect classification and correlation.

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Product Overview

Discover Review software improves system productivity by enabling its users to review results offline. Users can examine defect results from any inspection tool connected to the Discover server. Multiple client usage enhances productivity by supporting concurrent review with overwrite protection while partial review status enables operator shift changes. Visualize defects individually or collectively using an interactive, all-surface (front, edge, back) wafer map viewer. The gallery review mode allows users to select individual or multiple images by wafer or die for fast classification and defect comparison. Discover Review Software also includes a large number of wafer map exports and customizable reports.

 

Discover® Review Software

Point-to-point review and advanced image browsing

Applications

  • Memory
  • Logic
  • Foundry
  • Compound-Semi
  • LED
  • Advanced Packaging

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