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Challenges In Stacking HBM
Challenges in Stacking HBM

Learn how to reduce stress that causes warpage, how HBM architectures will need to change, and what happens when hybrid bonding and co-packaged optics are added into these devices from Onto Innovation's topical video with Semiconductor Engineering.

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Challenges In Stacking HBM
Challenges in Stacking HBM
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Discover® FDC Software

Discover FDC software is part of a robust data management suite, serving as the ideal gateway to digital transformation and unlocking Industry 4.0 best practices for impactful results.

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Product Overview

Discover FDC software transforms tool sensor data into actionable insights. It empowers manufacturers to optimize fab efficiency, scaling seamlessly to high-volume manufacturing while reducing tool downtime by detecting anomalies early. With its diverse set of flexible controls and real-time data analysis, Discover FDC software enhances productivity, improves cycle time and increases equipment availability (OEE). Its user-friendly interface integrates advanced process control, allowing engineers to pinpoint issues and bring equipment online faster. Proven across processes and operational modules, it eliminates wasted time and energy by preventing idle tools and minimizing scrapped wafers. When connected to Discover Defect and Discover Yield software, Discover FDC software identifies meaningful correlations that drive even greater efficiency and production results. This robust solution redefines control, setting a new standard for achieving maximum enterprise-wide factory performance. That’s control, redefined.

 

Discover® FDC Software

Applications

  • Memory
  • Logic
  • ASIC
  • Compound-Semi
  • HDD
  • Advanced Packaging

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Discover® Defect Software

Integrated defect management system that works seamlessly with Onto tools and your entire enterprise, bringing data together for greater visibility and cleaner operation.
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Discover® Run-to-Run Software

Automating process control with precision and efficiency
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Achieving Zero Defect Manufacturing Part 3: Prevention Of Defects

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Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources

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Using Advanced Analytics To Meet ESG Goals

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Metrology Sampling Plans Are Key For Device Analytics And Traceability

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Nip the Defect in the Bud: Using an external inspection system and FDC software increases ABF substrate yield

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