Discover® Defect Software
Discover Defect software provides actionable value to raw data through its intelligent, real-time analytics techniques. Inline monitoring, alarming and reporting is standard with all inspection tools, as well as offline fab-wide analysis with all licensed third-party tools.
Product Overview
Discover Defect software readily integrates into any wafer or panel production environment. It flexibly brings together all pertinent fab information, including defect, sort, metrology, wip, and electrical, into a single big data-capable solution. Its speed and up-time are world class.
Discover Defect software will pay for itself repeatedly by enabling its users to identify and solve problems, as well as to monitor and alarm on known areas of concern quickly and accurately. The product is designed to improve both throughput and yield while simultaneously reducing manufacturing costs.
Expand your yield analysis capabilities with the power of the Discover Yield software module. Discover Yield software’s patented data mining capabilities and advanced statistical analysis allow for highly sophisticated, interactive root cause analysis. Discover Yield software gives you the power to deep-dive into your data to uncover even the most difficult-to-identify systemic process issues.
Applications
- Memory
- Logic
- Foundry
- Compound-Semi
- LED
- Advanced Packaging
Discover Mapping Suite
Comprehensive mapping suite that covers all aspects of semiconductor processes
Discover High Volume Metrology (HVM) Bump Server
Targeted modules specific to customer challenges
Discover® Yield Software
Discover® Review Software
Discover® Patterns Software
Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources
The Importance of Secure Data Sharing
Optimizing Advanced IC Substrates (AICS) for PLP
Addressing Yield Challenges in Advanced IC Substrate (AICS) Packaging
Sky High: More Thoughts To Consider Before Transitioning To The Cloud
Up and Away!: Clear-eyed considerations for your cloud-adoption journey
Nip the Defect in the Bud: Using an external inspection system and FDC software increases ABF substrate yield
The Big Squeeze – Why OSATs Need to Work Smarter
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