The Atlas III+ thin film and OCD system is latest generation metrology tool for leading-edge 3D device manufacturing.
By extending metrology performance to sub-angstrom precision and accuracy levels, the Atlas III+ system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas family of products incorporate a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s industry leading Spectraprobe™ and NanoDiffract® OCD analysis software, enable process control of every critical manufacturing unit operation. The Atlas III+ system and NanoDiffract solution provides insight of complex structure profiles across etch, clean, deposition and CMP steps.
Atlas XP+ system offers a single platform for both thin film and OCD measurements for 200mm wafer metrology. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The system also features advanced pattern recognition, improved thickness reproducibility and superior SR and SE throughput. The N2000™ software interface and advanced automation are compliant with standards adopted by SEMI and other organizations. The NanoNet® feature, a network component of the N2000 Analysis Platform software provides system-to-system matching and seamless recipe transferability.