Designed to meet the demands of advanced semiconductor technologies, the Dragonfly G5 system is purpose-built to deliver high-performance, reliable inspection and metrology across complex heterogeneous integration processes. Leveraging next generation high speed line scan 2D imaging and custom-engineered objectives, the system achieves over 3X throughput improvement compared to its predecessor, with submicron sensitivity down to 150nm. 

Continuing the legacy of innovation, the Dragonfly G5 system introduces a multi-angle illumination channel that significantly improves signal-to-noise ratio for faint defect detection. Combined with powerful AI-driven algorithms, it enhances both the detectability and classification of critical, yield-impacting defects–empowering fabs to maintain quality and accelerate time-to-yield. 

The Dragonfly G5 system expands process control flexibility for wafer-to-wafer and die-to-wafer bonding by integrating high-speed IR imaging to detect sub-surface defects. It incorporates the latest generation of 3Di™ technology, extending bump height metrology capabilities to support next-generation microbumps essential for 3D integration. This enables additional inspection and metrology touchpoints across increasingly complex packaging architectures. 

The PrimaScan system utilizes laser scatterometry and imaging techniques leveraging proprietary optics and sensing technologies for reliable inspection of nanometer sized defects on a variety of opaque and transparent/semi-transparent substrates suitable for either R&D or high-volume manufacturing environments. With multiple detection channels, the system can detect, measure, characterize and image surface particles, scratches, pits, bumps, surface contamination, film or bulk wafer stress, voids/inclusions, including chips and cracks at the wafer edge.

The PrimaScan system addresses challenges in both incoming wafer quality control and in inline process monitoring. Capable of handling multiple substrate materials, it uniquely addresses inline process defect and contamination monitoring in wafer-based production environments.

Designed with versatility in mind the PrimaScan system can handle a variety of wafer sizes and substrate types

The 4Di InSpec Automated Measurement System is a non-contact optical surface gauge, either the 4D InSpec or 4D InSpec XL, integrated with a choice of collaborative robots, an optional rotary table and a safety cell for rapid production inspection.

This fully automated 3D optical system can measure dozens of edge break features, chamfers, and radii in minutes, vastly improving throughput and driving down inspection costs.

Designed as a turnkey cell for quality control, it is ideal for precision machined components such as turbine blades and rotors, air foils, high pressure compressor blades, blisks and dovetails. The high resolution system can measure in any orientation, on curved surfaces, over large and complex geometries, and in tight spaces or blind locations.

The 4Di InSpec AMS accurately captures complex feature dimensions, enabling more precise part disposition. Its rapid measurement capabilities reduce inspection queuing times, while the ability to measure at multiple locations in the same timeframe ensures part quality.

The 4Di InSpec optical surface gauge is the first handheld precision instrument designed for non-contact surface defect measurement. With micrometer-level resolution, portability, affordability and ease-of-use, the 4Di InSpec surface gauge brings high resolution 3D surface measurement where it’s needed: on the factory floor, in machine shops, and in field service applications.

This surface gauge provides 3D surface measurements to instantly quantify defects and features up to 100 mils (2,540 micrometers) deep. Without the need for replication, it can measure large components of varying complex geometries directly. It is adaptable for handheld use, workstation setups, or robotic operation with optional accessories to meet specific customer challenges.

Even with its incredible precision and extensive analysis capabilities, its ease of use allows non-experts to take measurements after just minutes of training.

The PrecisionWoRx VX4 System gives test facilities and probe card manufacturers the ability to confidently test tighter pitches and smaller probe tips. The system can be configured to meet specific requirements for a variety of probe card technologies. For processes using cards with very small probe tips, the system’s high-resolution optics deliver a detailed field-of-view for high accuracy and repeatability. Proprietary image-processing recipes control over 30 imaging parameters for enhanced testing of most probe tip geometries in use today.

The PrecisionWoRx VX4 System improves overall cost of ownership with faster test times for common tests, including leakage, planarity, alignment, contact resistance, probe force and wire checker. Its sophisticated electrical discharge management capability maintains 1-volt continuity to the probe during electrical testing. Productivity-enhanced routines for automated testing of failed probes and a wide variety of checkplates suit an extensive range of process and technology requirements. The system provides support for the most complex probe card technologies.