The PrimaScan system utilizes laser scatterometry and imaging techniques leveraging proprietary optics and sensing technologies for reliable inspection of nanometer sized defects on a variety of opaque and transparent/semi-transparent substrates suitable for either R&D or high-volume manufacturing environments. With multiple detection channels, the system can detect, measure, characterize and image surface particles, scratches, pits, bumps, surface contamination, film or bulk wafer stress, voids/inclusions, including chips and cracks at the wafer edge.

The PrimaScan system addresses challenges in both incoming wafer quality control and in inline process monitoring. Capable of handling multiple substrate materials, it uniquely addresses inline process defect and contamination monitoring in wafer-based production environments.

Designed with versatility in mind the PrimaScan system can handle a variety of wafer sizes and substrate types

The 4Di InSpec Automated Measurement System is a non-contact optical surface gauge, either the 4D InSpec or 4D InSpec XL, integrated with a choice of collaborative robots, an optional rotary table and a safety cell for rapid production inspection.

This fully automated 3D optical system can measure dozens of edge break features, chamfers, and radii in minutes, vastly improving throughput and driving down inspection costs.

Designed as a turnkey cell for quality control, it is ideal for precision machined components such as turbine blades and rotors, air foils, high pressure compressor blades, blisks and dovetails. The high resolution system can measure in any orientation, on curved surfaces, over large and complex geometries, and in tight spaces or blind locations.

The 4Di InSpec AMS accurately captures complex feature dimensions, enabling more precise part disposition. Its rapid measurement capabilities reduce inspection queuing times, while the ability to measure at multiple locations in the same timeframe ensures part quality.

The 4D InSpec optical surface gauge is the first handheld precision instrument designed for non-contact surface defect measurement. With micrometer-level resolution, portability, affordability and ease-of-use, the 4D InSpec surface gauge brings high resolution 3D surface measurement where it’s needed: on the factory floor, in machine shops, and in field service applications.

This surface gauge provides 3D surface measurements to instantly quantify defects and features up to 100 mils (2,540 micrometers) deep. Without the need for replication, it can measure large components of varying complex geometries directly. It is adaptable for handheld use, workstation setups, or robotic operation with optional accessories to meet specific customer challenges.

Even with its incredible precision and extensive analysis capabilities, its ease of use allows non-experts to take measurements after just minutes of training.

The PrecisionWoRx VX4 System gives test facilities and probe card manufacturers the ability to confidently test tighter pitches and smaller probe tips. The system can be configured to meet specific requirements for a variety of probe card technologies. For processes using cards with very small probe tips, the system’s high-resolution optics deliver a detailed field-of-view for high accuracy and repeatability. Proprietary image-processing recipes control over 30 imaging parameters for enhanced testing of most probe tip geometries in use today.

The PrecisionWoRx VX4 System improves overall cost of ownership with faster test times for common tests, including leakage, planarity, alignment, contact resistance, probe force and wire checker. Its sophisticated electrical discharge management capability maintains 1-volt continuity to the probe during electrical testing. Productivity-enhanced routines for automated testing of failed probes and a wide variety of checkplates suit an extensive range of process and technology requirements. The system provides support for the most complex probe card technologies.

The NSX 330 system features robust platform technology with high-acceleration staging, high-speed multi-processor computing and flexible software. With over 1,000 installation worldwide, the NSX 330 System offers 2D inspection and metrology at high throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications. These include wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.

Accommodating wafers from 100mm to 330mm, the system features a versatile objective turret, programmable light tower, and multiple dark field illumination modes. Additional features include resolution flexibility, unique handling solutions, and comprehensive software for recipe sharing and offline analysis. The NSX 330 system, with optional edge and backside inspection via the EB40 module, provides a comprehensive all-surface inspection solution packaging technology challenges.